Semiconductor device
Provided is a technique for preventing warps of cooling plates due to a contraction of a joining material, thereby preventing a reduction in cooling performance of a semiconductor device. The semiconductor device includes the following: a first cooling plate; a second cooling plate facing the first cooling plate; a semiconductor chip joined between the circuit pattern of the first cooling plate and the circuit pattern of the second cooling plate with a joining material; and a case containing part of the first cooling plate, part of the second cooling plate, and the semiconductor chip. The semiconductor chip is mounted in a semiconductor-chip mounting part between the first cooling plate and the second cooling plate. The case is provided with a portion corresponding to the semiconductor-chip mounting part and to surroundings thereof. The portion has an up-and-down width greater than an up-and-down width of the remaining portions of the case.
1. A semiconductor device comprising:
a first cooling plate comprising a circuit pattern disposed on an insulator;
a second cooling plate facing the first cooling plate and comprising a circuit pattern disposed on an insulator;
a semiconductor chip joined between the circuit pattern of the first cooling plate and the circuit pattern of the second cooling plate with a joining material; and
a case having an opening at a center portion, the case holding outer peripheries of the first cooling plate and the second cooling plate, and the opening containing part of the first cooling plate, part of the second cooling plate, and the semiconductor chip,
wherein the semiconductor chip is directly mounted to a semiconductor-chip mounting part positioned at the center portion of the case and between the first cooling plate and the second cooling plate,
wherein the case comprises a plurality of sidewalls extending entirely around the opening, each of the plurality of sidewalls including a portion covering the semiconductor-chip mounting part and positioned at the center portion of the each of the plurality of sidewalls of the case, each sidewall portion having a width along a direction parallel to a center axis of the opening greater than widths along the direction of remaining portions of the sidewall of the case,
wherein the widths continuously vary, and
wherein an upper end of each of the plurality of sidewalls is upwardly protuberant as the upper end approaches the semiconductor-chip mounting part from an edge of the case in its lateral direction, and a lower end of each of the plurality of sidewalls is downwardly protuberant as the lower end approaches the semiconductor-chip mounting part from the edge of the case in its lateral direction.
2. The semiconductor device according to claim 1 ,
wherein the case comprises a first side opening through which an insulating material is injected, and a second side opening through which air is ejected during the injection of the insulating material, and
wherein the second side opening faces the first side opening and is located in a higher position than the first opening.
3. The semiconductor device according to claim 1 , wherein the semiconductor device is a motor-vehicle semiconductor module.
4. A semiconductor device comprising:
a first cooling plate comprising a circuit pattern disposed on an insulator;
a second cooling plate facing the first cooling plate and comprising a circuit pattern disposed on an insulator;
a semiconductor chip joined between the circuit pattern of the first cooling plate and the circuit pattern of the second cooling plate with a joining material; and
a case having an opening at a center portion, the case holding outer peripheries of the first cooling plate and the second cooling plate, and the opening containing part of the first cooling plate, part of the second cooling plate, and the semiconductor chip,
wherein the semiconductor chip is mounted in a semiconductor-chip mounting part positioned at the center portion of the case and between the first cooling plate and the second cooling plate,
wherein the case comprises a sidewall including a portion covering the semiconductor-chip mounting part and positioned at a center portion of the sidewall of the case, the sidewall center portion having a width along a direction parallel to a center axis of the opening, and the sidewall center portion width is greater than widths of the sidewall on each side of the sidewall center portion,
wherein the widths continuously vary, and
wherein an upper end of the case is upwardly protuberant as the upper end approaches the semiconductor-chip mounting part from an edge of the case in its lateral direction, and a lower end of the case is downwardly protuberant as the lower end approaches the semiconductor-chip mounting part from the edge of the case in its lateral direction.
5. The semiconductor device according to claim 4 ,
wherein the case comprises a first side opening through which an insulating material is injected, and a second side opening through which air is ejected during the injection of the insulating material, and
wherein the second side opening faces the first side opening and is located in a higher position than the first opening.
6. The semiconductor device according to claim 4 , wherein the semiconductor device is a motor-vehicle semiconductor module.
7. A semiconductor device comprising:
a first cooling plate comprising a circuit pattern disposed on an insulator;
a second cooling plate facing the first cooling plate and comprising a circuit pattern disposed on an insulator;
a semiconductor chip joined between the circuit pattern of the first cooling plate and the circuit pattern of the second cooling plate with a joining material; and
a case having an opening at a center portion, the case holding outer peripheries of the first cooling plate and the second cooling plate, and the opening containing part of the first cooling plate, part of the second cooling plate, and the semiconductor chip,
wherein the semiconductor chip is mounted in a semiconductor-chip mounting part positioned at the center portion of the case and between the first cooling plate and the second cooling plate,
wherein the opening is open in an up-and-down direction of the case, the up-and-down direction being a direction of stacking of the first cooling plate, the second cooling plate, and the semiconductor chip;
wherein the case comprises a sidewall including a portion covering the semiconductor-chip mounting part and positioned at the center portion of the sidewall of the case, the sidewall portion having a width along a direction parallel to a center axis of the opening greater than widths along the direction of remaining portions of the sidewall of the case,
wherein the widths continuously vary, and
wherein an upper end of the case is upwardly protuberant as the upper end approaches the semiconductor-chip mounting part from an edge of the case in its lateral direction, and a lower end of the case is downwardly protuberant as the lower end approaches the semiconductor-chip mounting part from the edge of the case in its lateral direction.
8. The semiconductor device according to claim 7 ,
wherein the case comprises a first side opening through which an insulating material is injected, and a second side opening through which air is ejected during the injection of the insulating material, and
wherein the second side opening faces the first side opening and is located in a higher position than the first opening.
9. The semiconductor device according to claim 7 , wherein the semiconductor device is a motor-vehicle semiconductor module.