Transceiver module

1. A system comprising:

a system board comprising first contacts;

a cage attached to the system board over the first contacts, including guide rails;

the cage to accept a removable transceiver module, wherein the removable transceiver module comprises a module hood, module carrier and second contacts; wherein the module carrier includes guide pins that extend through angled slots formed in the module hood so that the guide pins are received by the guide rails of the cage in a lateral movement with respect to the cage to align the second contacts with the first contacts and, as the transceiver module is fully inserted into the cage, the guide pins move at an angle to force a vertical movement of the transceiver module with respect to the cage to electrically connect the first contacts to the second contacts.

2. The system of claim 1 , wherein the module carrier is disposed within the module hood such that the transceiver module is installable in the cage in response to one continuous lateral movement of the module hood into the cage such that the module hood first moves the module carrier in the lateral movement and in the vertical movement to align and electrically connect the second contacts to the first contacts.

3. The system of claim 1 , wherein the transceiver module comprises alignment features to engage with alignment features of the system board with the transceiver module installed in the cage.

4. The system of claim 1 , wherein the cage comprises an electromagnetic interference gasket to prevent air flow and electromagnetic leakage between a cable bulkhead of the transceiver module and the cage with the transceiver module installed in the cage.

5. The system of claim 1 , wherein the transceiver module comprises a first opening to expose a heat sink of a transceiver chip within the transceiver module, and

wherein the cage comprises a second opening to expose the heat sink to air flow with the transceiver module installed in the cage.

6. The system of claim 1 , wherein the cage comprises a latch receiving mechanism, and

wherein the transceiver module comprises a latch mechanism that engages with the latch receiving mechanism with the transceiver module installed in the cage.

7. A device comprising:

a system board comprising contacts to electrically couple to a removable transceiver module;

wherein the removable transceiver module includes a module hood comprising angled slots, a module carrier comprising guide pins that extend through the angled slots of the module hood; and

a cage coupled to the system board over the contacts, the cage comprising first guide rails to laterally receive the guide pins of the module carrier and second guide rails perpendicular to and connected to the first guide rails to vertically position, via vertical movement of the module hood about the guide pins, the transceiver module to electrically couple the transceiver module to the contacts in response to the transceiver module being installed in the cage.

8. The device of claim 7 , further comprising:

a socket attached to the system board within the cage, the socket having contacts electrically coupled to the contacts of the system board.

9. The device of claim 7 , wherein the contacts comprise spring contacts having different heights.

10. The device of claim 9 , wherein the contacts comprise ground contacts having a first height, power contacts having a second height less than the first height, and signal contacts having a third height less than the second height.

11. A device comprising:

a module hood comprising slots;

a module carrier within the module hood, the module carrier supporting a transceiver chip within the module carrier, the module carrier comprising guide pins on sides of the module carrier that couple to guide rails of a cage, and wherein the guide pins extend through the slots of the module hood such that lateral movement of the module hood with respect to the module carrier conveys a vertical movement to the module carrier with respect to the module hood.

12. The device of claim 11 , further comprising:

a substrate assembly attached to the module carrier, the substrate assembly comprising a substrate frame attached to a substrate, the substrate electrically coupled to the transceiver chip, and the substrate comprising contacts to electrically couple the transceiver chip to contacts of a system board.

13. The device of claim 12 , wherein the module carrier is attached to the substrate frame by a plurality of bolts, each bolt surrounded by a spring to apply a force between the substrate frame and the module carrier such that compression of each spring overdrives the substrate assembly to electrically couple the contacts of the substrate to contacts of system board.

14. The device of claim 12 , further comprising:

a sliding lid to cover the contacts of the substrate when closed and to expose the contacts of the substrate when opened.

15. The device of claim 11 , further comprising:

a cable bulkhead attached to the module hood, the cable bulkhead comprising an optical connector optically coupled to the transceiver chip.