Method for manufacturing nitride semiconductor substrate and nitride semiconductor substrate
View Patent ↗A nitride semiconductor substrate is manufactured by a method which includes growing nitride semiconductor crystal along a c-axis direction on a +C-plane of a seed crystal substrate formed of nitride semiconductor crystal to form an n − -type first nitride semiconductor layer; growing the nitride semiconductor crystal along the c-axis direction on the +C-plane of the first nitride semiconductor layer to form a second nitride semiconductor layer; and removing the seed crystal substrate and exposing a −C-plane of the first nitride semiconductor layer to obtain as a semiconductor substrate a laminate of the first nitride semiconductor layer and the second nitride semiconductor layer, with the −C plane as a main surface.
1. A method for manufacturing a GaN substrate comprising:
growing GaN crystal along a c-axis direction on a +C-plane of a seed crystal substrate formed of GaN crystal to form an n − -type first GaN layer having an n-type impurity concentration that is relatively low;
growing the GaN crystal along the c-axis direction on the +C-plane of the first GaN layer to form an n + -type second GaN layer having an n-type impurity concentration that is relatively high; and
removing the seed crystal substrate and exposing a −C-plane of the first GaN layer to obtain as a semiconductor substrate a laminate of the first GaN layer and the second GaN layer, with the −C plane as a main surface,
wherein an electric resistivity of the first GaN layer is 50 Ωcm or less under a temperature condition of 20° C. or more and 200° C. or less, and
an electric resistivity of the second GaN layer is 2×10 −2 Ωcm or less under a temperature condition of 20° C. or more and 200° C. or less.
2. The method for manufacturing the GaN substrate according to claim 1 ,
wherein, in the first GaN layer, the n-type impurity concentration in the GaN crystal is less than 1×10 17 at/cm 3 .
3. The method for manufacturing the GaN substrate according to claim 1 ,
wherein at least each of the first GaN layer and the second GaN layer is formed by a hydride vapor phase epitaxy method.
4. The method for manufacturing the GaN substrate according to claim 1 , further comprising:
ion-implanting a p-type impurity into the −C-plane which is the main surface of the GaN substrate; and
annealing the GaN substrate after ion-implanting.
5. The method for manufacturing the GaN substrate according to claim 4 ,
wherein the annealing is performed in a high temperature region at 1200° C. or more.
6. The method for manufacturing the GaN substrate according to claim 1 ,
wherein formation of the first GaN layer and formation of the second GaN layer are repeatedly performed to obtain a laminate structure in which the first GaN layer and the second GaN layer are alternately laminated and further to obtain a plurality of the GaN substrates from the laminate structure.
7. A GaN substrate constituted by a laminate of a first GaN layer formed of GaN crystal and a second GaN layer formed of GaN crystal,
wherein the first GaN layer is of n − -type having a −C-plane as an exposed plane, a concentration of an n-type impurity in the GaN crystal is relatively low, and the n-type impurity concentration in the GaN crystal is less than 1×10 17 at/cm 3 ,
a concentration of an n-type impurity in the GaN crystal is relatively high in the second GaN layer,
an electric resistivity of the first GaN layer is 50 Ωcm or less under a temperature condition of 20° C. or more and 200° C. or less, and
an electric resistivity of the second GaN layer is 2×10 −2 Ωcm or less under a temperature condition of 20° C. or more and 200° C. or less.
8. The GaN substrate according to claim 7 ,
wherein the −C-plane is a mirror-polished plane in the first GaN layer.
9. The GaN substrate according to claim 7 ,
wherein the −C-plane in the first GaN layer has a portion into which the p-type impurity is to be injected.