Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.
1. An apparatus for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate, the apparatus comprising:
a substrate conveyance mechanism movable in two axes to make primary positional adjustments of the first substrate;
a micro-adjustment mechanism coupled with the substrate conveyance mechanism, the micro-adjustment mechanism configured to hold the first substrate and to make secondary positional adjustments on a scale smaller than the primary positional adjustments caused by the substrate conveyance mechanism, and the micro-adjustment mechanism including:
a micro-adjustment actuator having a movable distal end, and
a substrate holder frame configured to secure the first substrate, and the substrate holder frame being movable via actuation of the distal end of the micro-adjustment actuator;
a substrate frame configured to secure the second substrate such that a transfer surface of the second substrate is disposed facing the semiconductor device die disposed on the first substrate; and
a transfer mechanism configured to press on the first substrate and transfer the semiconductor device die to the second substrate.
2. The apparatus according to claim 1 , wherein the micro-adjustment mechanism further includes:
a wafer support to secure the substrate holder frame, and
a return member to reset the substrate holder frame in a neutral position, and
wherein the distal end of the micro-adjustment actuator is disposed proximate to the wafer support.
3. The apparatus according to claim 1 , wherein the micro-adjustment actuator is a first micro-adjustment actuator,
wherein the micro-adjustment mechanism further includes a second micro-adjustment actuator having a distal end positioned to adjust a position of the substrate holder frame, and
wherein the distal end of the first micro-adjustment actuator is positioned to adjust the position of the substrate holder frame in a location displaced by about 90 degrees respective to the distal end of the second micro-adjustment actuator.
4. The apparatus according to claim 1 , wherein the micro-adjustment mechanism is a two-axis rail conveyance mechanism.
5. The apparatus according to claim 1 , wherein the micro-adjustment mechanism further includes a substage plate attached to the substrate conveyance mechanism.
6. The apparatus according to claim 5 , wherein the micro-adjustment mechanism further includes:
a first pair of parallel rails attached to the substage plate, the first pair of parallel rails extending in a first direction,
a first axis slide plate having a first side opposite a second side thereof, the first axis slide plate being indirectly connected to the substage via the first pair of parallel rails on the first side of the first axis slide plate,
a second pair of parallel rails attached to the second side of the first axis slide plate, the second pair of parallel rails extending in a second direction that is transverse to the first direction, and
a second axis slide plate indirectly connected to the first axis slide plate via the second pair of parallel rails, the second axis slide plate supporting the substrate holder frame.
7. The apparatus according to claim 6 , wherein the movable distal end of the micro-adjustment actuator is disposed to contact an edge of the first axis slide plate.