IP Library Granted Patent US 11,115,567
Granted Patent B2
US 11,115,567 · App. 16/885,928 · Granted Sep 7, 2021

Image capture assembly and aerial photographing aerial vehicle

Inventors: Lei Zhang (Shenzhen, CN); Hao Liu (Shenzhen, CN); Lei Wang (Shenzhen, CN)
Assignee: SZ DJI TECHNOLOGY CO., LTD.
H04N5/2252G03B17/55H04N5/2253H04N5/2254H04N5/2257H04N5/22521H05K1/0203H05K1/0209H05K1/11H05K7/20409H05K7/20463H05K2201/066H05K2201/10121
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Quick Facts
Patent No.
US 11,115,567
App. No.
16/885,928
Granted
Sep 7, 2021
Kind
B2
Abstract

An image capture assembly includes a heat-conducting housing, a camera component in the heat-conducting housing, and a heat-conducting sheet. The heat-conducting sheet is attached to the camera component and arranged between the camera component and the heat-conducting housing to dissipate heat generated by the camera component to the heat-conducting housing. The heat-conducting sheet extends to a side wall of the camera component from a bottom side of the camera component.

Claims (70)

1. An image capture assembly comprising:

a heat-conducting housing;

a camera component in the heat-conducting housing and including a plurality of side walls; and

a heat-conducting sheet attached to the camera component and arranged between the camera component and the heat-conducting housing to dissipate heat generated by the camera component to the heat-conducting housing, the heat-conducting sheet extending to more than one of the plurality of side walls of the camera component from a bottom side of the camera component, a height of the heat-conducting sheet on each of the more than one of the plurality of side walls of the camera component being greater than a half of a height of each of the more than one of the plurality of side walls of the camera component.

2. The image capture assembly according to claim 1 , wherein the heat-conducting sheet on the more than one of the plurality side walls of the camera component is in direct contact with the heat-conducting housing.

3. The image capture assembly according to claim 1 , wherein the heat-conducting sheet on the more than one of the plurality side walls of the camera component is in indirect contact with the heat-conducting housing.

4. The image capture assembly according to claim 1 , wherein the heat-conducting sheet on the more than one of the plurality side walls of the camera component is spaced apart from the heat-conducting housing and faces toward heat-conducting housing.

5. The image capture assembly according to claim 1 , wherein:

the camera component includes:

a circuit board; and

a lens component supported by the circuit board and including a lens housing for accommodating lenses; and

the heat-conducting sheet extends to more than one of a plurality side walls of the lens housing from a side of the circuit board that faces away from the lens component.

6. The image capture assembly according to claim 5 , wherein an inner wall of the lens housing includes threads.

7. The image capture assembly according to claim 5 , wherein:

the camera component further includes an image sensor supported by the circuit board, electrically coupled to the circuit board, and accommodated by the lens component;

the lens housing includes a first open end and a second open end; and

the circuit board seals the first open end of the lens housing, and the second open end of the lens housing is exposed through the heat-conducting housing.

8. The image capture assembly according to claim 7 , further comprising:

a circuit board adapter in the heat-conducting housing and electrically coupled to the circuit board.

9. The image capture assembly according to claim 8 , wherein:

the circuit board and the circuit board adapter are plugged together; and

a heat-conducting filler is filled between the circuit board and the circuit board adapter.

10. The image capture assembly according to claim 9 , wherein:

the circuit board adapter includes an adapter plate and a plurality of electronic components;

the adapter plate includes a first surface and a second surface opposite to each other;

the plurality of electronic components are electrically arranged at the first surface; and

the circuit board are plugged to the circuit board adapter at the first surface.

11. The image capture assembly according to claim 10 , wherein:

the circuit board includes one of a male connector and a female connector;

the first surface includes another one of the male connector and the female connector; and

the male connector is inserted in the female connector.

12. The image capture assembly according to claim 10 , wherein the heat-conducting filler covers the plurality of electronic components.

13. The image capture assembly according to claim 10 ,

wherein the heat-conducting tiller is a first heat-conducting filler;

the image capture assembly further comprising:

a heat sink arranged at the second surface and contacting the heat-conducting housing; and

a second heat-conducting filler is filled between the heat sink and the second surface of the adapter plate.

14. The image capture assembly according to claim 13 , wherein:

the electronic components are first electronic components;

the circuit board adapter includes a plurality of second electronic components;

the plurality of second electronic components are electrically coupled to the second surface of the adapter plate; and

the second heat-conducting filler completely covers the plurality of second electronic components.

15. The image capture assembly according to claim 14 , wherein:

the heat sink includes a heat dissipation body and a plurality of heat dissipation fins extending outward from the heat dissipation body;

the heat dissipation body is disposed at the second surface of the adapter plate; and

the plurality of heat dissipation fins are spaced apart from each other and arranged at a side of the heat dissipation body facing away from the second surface of the adapter plate.

16. The image capture assembly according to claim 15 , wherein:

the heat-conducting housing includes a first housing and a second housing; and

the first housing is coupled to the second housing to form an accommodating space for accommodating the camera component, the heat-conducting sheet, the circuit board adapter, and the heat sink.

17. The image capture assembly according to claim 16 , wherein:

the first housing includes a coupling portion and an accommodating portion extending outward from the coupling portion;

the coupling portion is coupled to the second housing to form the accommodating space;

the lens housing is accommodated in the accommodating portion; and

the plurality of side walls of the lens housing are aligned with a plurality of side walls of the accommodating portion, respectively.

18. The image capture assembly according to claim 17 , wherein:

the accommodating portion includes a light inlet;

the second open end is aligned with the light inlet;

an inner wall of the second housing extends inwardly to form a flange; and

the plurality of heat dissipation fins are supported by the flange.

19. The image capture assembly according to claim 18 , wherein:

the heat sink is coupled to the second housing; and

an edge of the heat sink body is aligned with the inner wall of the second housing.

20. The image capture assembly according to claim 1 , wherein:

the heat-conducting housing includes a first housing and a second housing, the first housing including:

a coupling portion coupled to the second housing to form an accommodating space; and

an accommodating portion extending outward from the coupling portion, the accommodating portion including a light inlet;

the camera component further includes:

a circuit board; and

a lens component supported by the circuit board and including a lens housing for accommodating lenses, the lens housing being accommodated in the accommodating portion, the lens housing including a first end sealed by the circuit board and a second end exposed through the heat-conducting housing, and the second open end being aligned with the light inlet;

wherein the heat-conducting sheet extends to more than one of a plurality of side walls of the lens housing from a bottom side of the circuit board that faces away from the lens component.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 28, 2020
From: ZHANG, LEI; LIU, HAO; WANG, LEI
To: SZ DJI TECHNOLOGY CO., LTD.
Reel/Frame 052776/0891 →
Continuity (3)
Continuation 15962670 · Apr 25, 2018
Continuation PCTCN2015095271 · Nov 23, 2015
Related Publication 20200296261A1 · Sep 17, 2020
Cited By (1)
US 12,495,193