Oxazine compound, composition, and cured product
The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.
1. An oxazine compound comprising:
a structure which is represented by General Formula (1-1):
wherein, in Formula (1-1), each R 1 independently represents a functional group represented by General Formula (2) or (3), and R 4 and R 5 each independently represent a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, or a substituted or unsubstituted aromatic group;
in Formula (2), X 1 , X 2 , and Y 1 each independently represent a single bond or a divalent linking group, R 2 represents a hydrogen atom, a hydrocarbon group, or a hydrocarbon group in which one or more hydrogen atoms contained in the hydrocarbon group are substituted with any one of a hydroxyl group, an alkoxy group, and a halogen atom, and a 1 represents a bonding point to General Formula (1);
in Formula (3), n represents an integer of 2 to 6, X 3 and X 4 each independently represent a single bond or a divalent linking group, Y 2 represents a linking group having a valence of n+1, R 3 represents a hydrogen atom, a hydrocarbon group, or a hydrocarbon group in which one or more hydrogen atoms contained in the hydrocarbon group are substituted with any one of a hydroxyl group, an alkoxy group, and a halogen atom, and a 2 represents a bonding point to General Formula (1).
2. The oxazine compound according to claim 1 ,
wherein the ring A is a substituted or unsubstituted benzene ring or a substituted or unsubstituted naphthalene ring.
3. A composition comprising the oxazine compound according to claim 1 .
4. The composition according to claim 3 , further comprising a reactive compound.
5. The composition according to claim 3 , further comprising a filler.
6. The composition according to claim 3 , further comprising a fibrous substrate.
7. A cured product, which is obtained by curing the composition according to claim 3 .
8. A laminate comprising:
a base material; and
a layer of the cured product according to claim 7 .
9. A composition for a heat-resistant material, comprising the composition according to claim 3 .
10. A heat-resistant member comprising the cured product according to claim 7 .
11. A composition for an electronic material, comprising the composition according to claim 3 .
12. An electronic member comprising the cured product according to claim 7 .
13. A semiconductor sealing material comprising the composition according to claim 3 .
14. A prepreg comprising the composition containing a fibrous substrate according to claim 6 .
15. A circuit board further comprising the prepreg according to claim 14 and a copper foil layer.
16. The laminate according to claim 8 , which is a build-up film.
17. A build-up substrate comprising the build-up film according to claim 15 .