Photosensitive glass paste, electronic component, and method for producing electronic component
A photosensitive glass paste contains a photosensitive organic component, and an inorganic component containing a glass powder and a ceramic filler. The glass powder contains a glass powder having a crystallization point. The difference between the crystallization point and the softening point of the glass powder having a crystallization point is from 85° C. to 180° C. The glass powder having a crystallization point is preferably a SiO 2 —B 2 O 3 —BaO—ZnO—Al 2 O 3 —MgO—La 2 O 3 glass powder.
1. A photosensitive glass paste comprising:
a photosensitive organic component; and
an inorganic component containing a glass powder and a ceramic filler,
wherein
the glass powder contains a glass powder having a crystallization point,
a difference between the crystallization point and a softening point of the glass powder having a crystallization point is from 85° C. to 180° C., and
the glass powder has a softening point of 710° C. or higher and 810° C. or lower.
2. The photosensitive glass paste according to claim 1 , wherein
the glass powder having a crystallization point is a SiO 2 —B 2 O 3 —BaO—ZnO—Al 2 O 3 —MgO—La 2 O 3 glass powder.
3. The photosensitive glass paste according to claim 2 , wherein
the ceramic filler is at least one selected from the group consisting of alumina, zirconia, partially stabilized zirconia, silicon nitride, and silicon carbide.
4. The photosensitive glass paste according to claim 2 , wherein
an amount of the ceramic filler in the inorganic component is from 25 wt % to 48 wt %.
5. The photosensitive glass paste according to claim 2 , wherein
a proportion of the glass powder having a crystallization point in an entirety of the glass powder is 80 wt % or more.
6. The photosensitive glass paste according to claim 5 , wherein
the ceramic filler is at least one selected from the group consisting of alumina, zirconia, partially stabilized zirconia, silicon nitride, and silicon carbide.
7. The photosensitive glass paste according to claim 5 , wherein
an amount of the ceramic filler in the inorganic component is from 25 wt % to 48 wt %.
8. The photosensitive glass paste according to claim 1 , wherein
a proportion of the glass powder having a crystallization point in an entirety of the glass powder is 80 wt % or more.
9. The photosensitive glass paste according to claim 1 , wherein
the ceramic filler is at least one selected from the group consisting of alumina, zirconia, partially stabilized zirconia, silicon nitride, and silicon carbide.
10. The photosensitive glass paste according to claim 1 , wherein
an amount of the ceramic filler in the inorganic component is from 25 wt % to 48 wt %.
11. An electronic component comprising a conductor layer and an insulating layer formed of a fired product of the photosensitive glass paste according to claim 1 .
12. The electronic component according to claim 11 , further comprising:
an insulating layer formed of an amorphous glass having no crystallization point.
13. A method for producing an electronic component, the method comprising:
forming an insulating layer by using the photosensitive glass paste according to claim 1 ; and
forming a conductor layer on the insulating layer by using a conductor paste.