IP Library › Granted Patent US 1,114,616
Granted Patent S1
US 1,114,616 · App. 29/899,960 · Granted Feb 24, 2026

Medical device package with surface ornamentation

Inventors: Kiran Padmakumari Devapalan (Bangalore, IN); Laurie Sanders (Glen Ridge, NJ); Robert William Kerwin (Parsippany-Troy Hills, NJ); Qin Chen (Parsippany, NJ)
Assignee: Becton, Dickinson and Company
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Quick Facts
Patent No.
US 1,114,616
App. No.
29/899,960
Granted
Feb 24, 2026
Kind
S1
Claims (1)

The ornamental design for a medical device package with surface ornamentation, substantially as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2023
From: DEVAPALAN, KIRAN PADMAKUMARI; SANDERS, LAURIE; KERWIN, ROBERT WILLIAM; CHEN, QIN
To: BECTON, DICKINSON AND COMPANY
Reel/Frame 064702/0635 →
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