Wafer reconstitution and die-stitching
Stitched die packaging techniques and structures are described in which reconstituted chips are formed using wafer reconstitution and die-stitching techniques. In an embodiment, a chip includes a reconstituted chip-level back end of the line (BEOL) build-up structure to connect a die set embedded in an inorganic gap fill material.
1. A chip comprising:
a reconstituted chip-level back end of the line (BEOL) build-up structure including a plurality of interconnects;
a die set including a first die and a second die on the reconstituted chip-level BEOL build-up structure, wherein the first die includes a first die-level BEOL build-up structure including damascene interconnects, and the second die includes a second die-level BEOL build-up structure including damascene interconnects; and
an inorganic gap fill material on the reconstituted chip-level BEOL build-up structure and surrounding the die set, wherein the inorganic gap fill material includes a silicon matrix.
2. The chip of claim 1 , wherein the reconstituted chip-level BEOL build-up structure includes damascene interconnects.
3. The chip of claim 2 , wherein the reconstituted chip-level BEOL build-up structure includes aluminum damascene interconnects.
4. The chip of claim 2 , wherein the reconstituted chip-level BEOL build-up structure includes die-to-die interconnections between the die set.
5. A chip comprising:
a reconstituted chip-level back end of the line (BEOL) build-up structure including a plurality of interconnects;
a die set on the reconstituted chip-level BEOL build-up structure; wherein the die set includes a first die and a second die, the first die includes a first die-level BEOL build-up structure, and the second die includes a second die-level BEOL build-up structure;
an inorganic gap fill material on the reconstituted chip-level BEOL build-up structure and surrounding the die set;
wherein the reconstituted chip-level BEOL build-up structure includes deep vias that connect to the first die-level BEOL build-up structure, and extend below test pads in the first die-level BEOL build-up structure.
6. The chip of claim 5 , wherein the reconstituted chip-level BEOL build-up structure includes intra-die interconnections for the first die, intra-die interconnections for the second die, and die-to-die interconnections between the first die and the second die.
7. The chip of claim 6 , wherein the die-to-die interconnections between first die and second die do not include ESD protection circuits.
8. The chip of claim 7 , wherein the reconstituted chip-level BEOL build-up structure includes ESD protection circuits connected to external reconstituted chip-level contact pads.
9. The chip of claim 6 , wherein the inorganic gap fill material includes a silicon matrix.
10. A method of fabricating a reconstituted wafer comprising:
mounting a plurality of groups of die sets face down onto a first carrier substrate;
depositing a gap fill material onto the first carrier substrate and laterally surrounding each die of the plurality of groups of die sets;
bonding a second carrier substrate opposite the first carrier substrate;
removing the first carrier substrate; and
building a reconstituted chip-level back end of the line (BEOL) build-up structure on back sides of the plurality of groups of die sets and in contact with a plurality of TSVs in the plurality of groups of die sets, after depositing the gap fill material and prior to bonding the second carrier substrate opposite the first carrier substrate.
11. The method of claim 10 , wherein the gap fill material is an oxide or oxynitride material.
12. The method of claim 10 , wherein the gap fill material comprises a silicon matrix.
13. The method of claim 10 , further comprising reducing a thickness of at least thicker die members of the die sets prior to depositing the gap fill material.
14. The method of claim 10 , further comprising forming a plurality of TSVs in the plurality of groups of die sets after depositing the gap fill material.
15. A method of fabricating a reconstituted wafer comprising:
mounting a plurality of groups of die sets face up onto a first carrier substrate, wherein each die set includes a first die and a second die, the first die including a first die-level back end of the line (BEOL) build-up structure including damascene interconnects, and the second die including a second die-level BEOL build-up structure including damascene interconnects; and
depositing a gap fill material onto the first carrier substrate and laterally surrounding each die of the plurality of groups of die sets, wherein the gap fill material comprises a silicon matrix.
16. The method of claim 15 , further comprising building a reconstituted chip-level back end of the line (BEOL) build-up structure on the plurality of groups of die sets and the gap fill material, wherein the reconstituted chip-level BEOL build-up structure includes damascene interconnects.
17. A wafer on wafer process comprising:
bonding a first reconstituted wafer of known good dies to a second reconstituted wafer of known good dies;
wherein the first reconstituted wafer of known good dies includes an array of dies embedded in a silicon matrix gap fill material, and each die in the array of dies includes a first die-level back end of the line (BEOL) build-up structure including damascene interconnects.
18. The wafer on wafer process of claim 17 , further comprising singulating a plurality of 3D reconstituted chips.
19. The wafer on wafer process of claim 17 , wherein the second reconstituted wafer of known good dies includes a second array of dies embedded in a second silicon matrix gap fill material.