Electric field switchable magnetic devices

1. A magnetic device comprising:

a layer stack comprising:

a first ferromagnetic layer;

a spacer layer on the first ferromagnetic layer;

a second ferromagnetic layer on the spacer layer;

a dielectric barrier layer on the second ferromagnetic layer;

an insertion layer positioned between the second ferromagnetic layer and the dielectric barrier layer, wherein the insertion layer is positioned adjacent to the dielectric barrier layer, and wherein the insertion layer comprises at least one of Ir, Rh, Mg, Ta, or Mo; and

a fixed layer or an electrode on the dielectric barrier layer; and

a voltage source configured to apply a bias voltage across the layer stack to cause switching of a magnetic orientation of the second ferromagnetic layer without application of an external magnetic field,

wherein the voltage source is configured to increase antiferromagnetic coupling of the first and second ferromagnetic layers by applying a negative charge to the fixed layer or the electrode, and

wherein the voltage source is configured to decrease the antiferromagnetic coupling of the first and second ferromagnetic layers by applying a positive charge to the fixed layer or the electrode.

2. The magnetic device of claim 1 , wherein the spacer layer comprises at least one of Ir, Ru, Ta, Re, Rh, Mo, W, NiO, CoO, or Fe 2 O 3 or a combination of two or more of Ir, Ru, Ta, Re, Rh, Mo, W, NiO, CoO, or Fe 2 O 3 in a layer structure, an alloy, or a compound structure.

3. The magnetic device of claim 1 ,

wherein the antiferromagnetic coupling of the first and second ferromagnetic layers is configured to store a bit at a first value by producing a first electrical current in response to a read voltage,

wherein a ferromagnetic coupling of the first and second ferromagnetic layers stores the bit at a second value,

wherein the ferromagnetic coupling of the first and second ferromagnetic layers produces a second electrical current in response to the read voltage, and

wherein the second electrical current is different than the first electrical current.

4. The magnetic device of claim 1 ,

wherein the layer stack further comprises an electrode layer,

wherein the first ferromagnetic layer is positioned on the electrode layer,

wherein the voltage source is configured to increase the antiferromagnetic coupling of the first and second ferromagnetic layers by applying the positive charge to the electrode layer, and

wherein the voltage source is configured to decrease the antiferromagnetic coupling of the first and second ferromagnetic layers or cause ferromagnetic coupling of the first and second ferromagnetic layers by applying the negative charge to the electrode layer.

5. The magnetic device of claim 1 ,

wherein the voltage source is configured to decrease the antiferromagnetic coupling of the first and second ferromagnetic layers by applying the positive charge to the fixed layer or the electrode at a magnitude that is less than a threshold level, and

wherein the voltage source is configured to cause ferromagnetic coupling of the first and second ferromagnetic layers by applying the positive charge to the fixed layer or the electrode at the magnitude that is greater than the threshold level.

6. The magnetic device of claim 1 ,

wherein the voltage source is configured to cause the switching of the magnetic orientation with a first hysteresis loop by applying the bias voltage with a positive polarity on the first ferromagnetic layer,

wherein the voltage source is configured to cause the switching of the magnetic orientation with a second hysteresis loop by applying the bias voltage with a negative polarity on the first ferromagnetic layer, and

wherein the first hysteresis loop is narrower than the second hysteresis loop.

7. The magnetic device of claim 1 , wherein the first ferromagnetic layer includes thulium or terbium.

8. The magnetic device of claim 1 , wherein the layer stack further comprises a spin-orbit-torque layer, and wherein the first ferromagnetic layer is on the spin-orbit-torque layer.

9. The magnetic device of claim 1 , wherein the dielectric barrier layer comprises oxide material deposited by a sputtering process.

10. The magnetic device of claim 1 , wherein the dielectric barrier layer comprises boron nitride.

11. The magnetic device of claim 1 ,

wherein the dielectric barrier layer further comprises silicon dioxide, and

wherein boron nitride is formed on the silicon dioxide as hexagonal boron nitride using a chemical vapor deposition process.

12. The magnetic device of claim 1 , wherein the positive charge, applied by the voltage source to the fixed layer or the electrode, reduces a coercivity of the second ferromagnetic layer relative to the negative charge applied to the fixed layer or the electrode.

13. The magnetic device of claim 12 , wherein the positive charge, applied by the voltage source to the fixed layer or the electrode, changes the coercivity of the second ferromagnetic layer by a greater magnitude than the negative charge, applied to the fixed layer or the electrode.

14. The magnetic device of claim 1 ,

wherein the voltage source is configured to control a number of oxygen atoms moved from the dielectric barrier layer into the second ferromagnetic layer by controlling the bias voltage, and

wherein the positive charge, applied by the voltage source to the fixed layer or the electrode, increases the number of oxygen atoms moved from the dielectric barrier layer into the second ferromagnetic layer relative to the negative charge applied to the fixed layer or the electrode.

15. A magnetic device comprising:

a layer stack comprising:

a first ferromagnetic layer;

a spacer layer on the first ferromagnetic layer;

a second ferromagnetic layer on the spacer layer;

a dielectric barrier layer on the second ferromagnetic layer, wherein the dielectric barrier layer comprises boron nitride; and

an insertion layer positioned between the second ferromagnetic layer and the dielectric barrier layer, wherein the insertion layer is positioned adjacent to the dielectric barrier layer, and wherein the insertion layer comprises at least one of Ir, Rh, Mg, Ta, or Mo; and

a voltage source configured to apply a bias voltage across the layer stack to cause switching of a magnetic orientation of the second ferromagnetic layer without application of an external magnetic field.

16. The magnetic device of claim 15 , wherein the spacer layer comprises at least one of Ir, Ru, Ta, Re, Rh, Mo, W, NiO, CoO, or Fe 2 O 3 or a combination of two or more of Ir, Ru, Ta, Re, Rh, Mo, W, NiO, CoO, or Fe 2 O 3 in a layer structure, an alloy, or a compound structure.

17. The magnetic device of claim 15 , wherein the dielectric barrier layer further comprises:

BiFeO 3 , BaTiO 3 , or lead magnesium niobate-lead titanate (PMN-PT); and

semiconductor material,

wherein the semiconductor material is formed on silicon dioxide, magnesium oxide, or the second ferromagnetic layer using a chemical vapor deposition or a sputtering process.

18. A method comprising:

controlling, in a first instance and by a write controller, a voltage source to output a positive bias voltage across a layer stack, wherein the layer stack comprises:

a first ferromagnetic layer;

a spacer layer on the first ferromagnetic layer;

a second ferromagnetic layer on the spacer layer, wherein the positive bias voltage decreases an antiferromagnetic coupling of the first and second ferromagnetic layers;

a dielectric barrier layer on the second ferromagnetic layer; and

an insertion layer positioned between the second ferromagnetic layer and the dielectric barrier layer,

wherein the insertion layer is positioned adjacent to the dielectric barrier layer,

wherein the insertion layer comprises at least one of Ir, Rh, Mg, Ta, or Mo,

wherein the positive bias voltage causes switching of a magnetic orientation of the second ferromagnetic layer from a first direction to a second direction without application of an external magnetic field, and

wherein the positive bias voltage increases antiferromagnetic coupling of the first and second ferromagnetic layers; and

controlling, in a second instance and by the write controller, the voltage source to output a negative bias voltage across the layer stack to decrease antiferromagnetic coupling of the first and second ferromagnetic layers.

19. The method of claim 18 , wherein the spacer layer comprises at least one of Ir, Ru, Ta, Re, Rh, Mo, W, NiO, CoO, or Fe 2 O 3 or a combination of two or more of Ir, Ru, Ta, Re, Rh, Mo, W, NiO, CoO, or Fe 2 O 3 in a layer structure, an alloy, or a compound structure.

20. The magnetic device of claim 15 ,

wherein the voltage source is configured to cause the switching of the magnetic orientation with a first hysteresis loop by applying the bias voltage with a positive polarity on the first ferromagnetic layer,

wherein the voltage source is configured to cause the switching of the magnetic orientation with a second hysteresis loop by applying the bias voltage with a negative polarity on the first ferromagnetic layer, and

wherein the first hysteresis loop is narrower than the second hysteresis loop.