IP Library Granted Patent US 11,190,889
Granted Patent B2
US 11,190,889 · App. 16/749,835 · Granted Nov 30, 2021

Semiconductor device and sound output device

Inventor: Takanori Hashimoto (Yokohama, JP)
Assignee: LAPIS SEMICONDUCTOR CO., LTD.
H04R29/001H03G3/301H04R2430/01
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Quick Facts
Patent No.
US 11,190,889
App. No.
16/749,835
Granted
Nov 30, 2021
Kind
B2
Abstract

A semiconductor device is provided, the device including a first detection section having a removal section to remove DC offset components included in each of an input signal and an output signal output from an amplification section that amplifies the input signal, and a correction section configured to perform correction to match phases of the input signal and the output signal from which the DC offset components have been removed, and to match gains of the input signal and of the output signal, the first detection section comparing a waveform of the input signal to a waveform of the output signal, and a second detection section to detect a mismatch between the DC offset component included in the input signal that is input into the removal section and the DC offset component included in the output signal that is input into the removal section.

Claims (26)

1. A semiconductor device comprising:

a first detection section including:

a removal section configured to remove DC offset components included in each of an input signal and an output signal output from an amplification section that amplifies the input signal, and

a correction section configured to perform correction to match phases of the input signal and the output signal from which the DC offset components have been removed, and to match gains of the input signal and of the output signal,

the first detection section being configured to compare a waveform of the input signal to a waveform of the output signal; and

a second detection section configured to detect a mismatch between the DC offset component included in the input signal that is input into the removal section and the DC offset component included in the output signal that is input into the removal section.

2. The semiconductor device of claim 1 , further comprising a third detection section configured to detect a mismatch between gain of the input signal that is input into the correction section and gain of the output signal that is input into the correction section.

3. A semiconductor device of claim 2 , further commprising a comparator that compares an amount of the mismatch detected by the third detection section against a predetermined fault detection threshold value.

4. The semiconductor device of claim 1 , further comprising a comparator that compares an amount of the mismatch detected by the second detection section against a predetermined fault detection threshold value.

5. A sound output device comprising:

a sound source configured to output a sound signal;

the semiconductor device of claim 1 , into which the sound signal is input as an input signal; and

a speaker configured to output a sound corresponding to an output signal output from the semiconductor device.

6. The semiconductor device comprising:

a first detection section including:

a removal section configured to remove DC offset components included in each of an input signal and an output signal output from an amplification section that amplifies the input signal, and

a correction section configured to perform correction to match phases of the input signal and the output signal from which the DC offset components have been removed, and to match gains of the input signal and of the output signal,

the first detection section being configured to compare a waveform of the input signal to a waveform of the output signal; and

a second detection section configured to detect mismatch between the gain of the input signal that is input into the correction section and the gain of the output signal that is input into the correction section.

7. The semiconductor device of claim 6 , further comprising a third detection section configured to detect a mismatch between the DC offset component inluded in the iput signal that is input into the removal section and the DC offset component inlcuded in the output signal that is input into the removal section.

8. The semiconductor device of claim 7 , further comprising a comparator that compares an amount of the mismatch detected by the third detection section against a predetermined fault detection threshold value.

9. The semiconductor device of claim 6 , further comprising a comparator that compares an amount of the mismatch detected by the second detection section against a predetermined fault detection threshold value.

10. A sound output device comprising:

a sound source configured to output a sound signal;

the semiconductor device of claim 6 , into which the sound signal is input as an input signal; and

a speaker configured to output a sound corresponding to an output signal output from the semiconductor device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2020
From: HASHIMOTO, TAKANORI
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 051589/0622 →
Priority Claims (1)
JP JP2019-009450 · Jan 23, 2019 · national
Continuity (1)
Related Publication 20200236483A1 · Jul 23, 2020
Cited By (1)
US 12,526,003