IP Library Granted Patent US 11,211,128
Granted Patent B1
US 11,211,128 · App. 17/061,713 · Granted Dec 28, 2021

Performing threshold voltage offset bin selection by package for memory devices

Inventors: Michael Sheperek (Longmont, CO); Kishore Kumar Muchherla (Fremont, CA); Mustafa N. Kaynak (San Diego, CA); Vamsi Pavan Rayaprolu (San Jose, CA); Bruce A. Liikanen (Berthoud, CO); Larry J. Koudele (Erie, CO)
Assignee: Micron Technology, Inc.
G11C16/20G11C16/26G11C16/30G11C16/32G11C16/3404G11C2207/2254
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,211,128
App. No.
17/061,713
Granted
Dec 28, 2021
Kind
B1
Abstract

An example memory sub-system includes a memory device and a processing device, operatively coupled to the memory device. The processing device is configured to initialize a block family associated with the memory device; program a first block in a first die of the memory device and a second block in a second die of the memory device, wherein the first die and the second die are assigned to a die group; associate the first block and the second block with the block family; and associate the die group with a first threshold voltage offset bin.

Claims (57)

1. A system comprising:

a memory device; and

a processing device, operatively coupled to the memory device, to perform operations comprising:

initializing a block family associated with the memory device;

programming a first block in a first die of the memory device and a second block in a second die of the memory device, wherein the first die and the second die are assigned to a die group;

associating the first block and the second block with the block family; and

associating the die group with a first threshold voltage offset bin.

2. The system of claim 1 , wherein the die group comprises a plurality of dice from a single substrate.

3. The system of claim 1 , wherein the die group comprises a first die from a first substrate and a second die from a second substrate.

4. The system of claim 1 , wherein the processing device is further to perform operations comprising:

responsive to detecting a triggering event, associating the die group with a second threshold voltage offset bin based on a calibration process performed on the first die.

5. The system of claim 1 , wherein the processing device is further to perform operations comprising:

initializing a timer associated with the block family;

responsive to detecting expiration of the timer, closing the block family.

6. The system of claim 1 , wherein associating the first block with the block family further comprises:

appending, to block family metadata, a record associating the first block with the block family.

7. The system of claim 1 , wherein the processing device is further to perform operations comprising:

determining a threshold voltage offset associated with the block family; and

computing a modified threshold voltage by applying the threshold voltage offset to a base read level voltage associated with the memory device;

reading, using the modified threshold voltage, data from the first block of the block family.

8. A method comprising:

initializing a block family associated with the memory device;

programming a first block in a first die of the memory device and a second block in a second die of the memory device, wherein the first die and the second die are assigned to a die group;

associating the first block and the second block with the block family; and

associating the first die and the second die with a threshold voltage offset bin based on a calibration process performed on the first die.

9. The method of claim 8 , wherein the first die and the second die are attached to a single substrate.

10. The method of claim 8 , wherein the die group comprises a first die from a first substrate and a second die from a second substrate.

11. The method of claim 8 , further comprising:

initializing a timer associated with the block family;

responsive to detecting expiration of the timer, closing the block family.

12. The method of claim 8 , wherein associating the first block with the block family further comprises:

appending, to block family metadata, a record associating the first block with the block family.

13. The method of claim 8 , further comprising:

determining a threshold voltage offset associated with the block family; and

computing a modified threshold voltage by applying the threshold voltage offset to a base read level voltage associated with the memory device;

reading, using the modified threshold voltage, data from the first block of the block family.

14. The method of claim 8 , further comprising:

programming a third block in a third die of the memory device, wherein the third die is assigned to the die group;

associating the third block with the block family; and

associating the third die with a further threshold voltage offset bin based on a calibration process performed on the first die and a pre-characterized offset associated with the third die.

15. A non-transitory computer-readable storage medium comprising instructions that,

when executed by a processing device operatively coupled to a memory device, perform operations comprising:

initializing a block family associated with the memory device;

programming a first block in a first die of the memory device and a second block in a second die of the memory device, wherein the first die and the second die are assigned to a die group;

associating the first block and the second block with the block family; and

associating the die group with a first threshold voltage offset bin.

16. The non-transitory computer-readable storage medium of claim 15 , wherein the die group comprises a plurality of dice from a single substrate.

17. The non-transitory computer-readable storage medium of claim 15 , wherein the die group comprises a first die from a first substrate and a second die from a second substrate.

18. The non-transitory computer-readable storage medium of claim 15 , wherein the processing device is further to perform operations comprising:

responsive to detecting a triggering event, associating the die group with a second threshold voltage offset bin based on a calibration process performed on the first die.

19. The non-transitory computer-readable storage medium of claim 15 , wherein the processing device is further to perform operations comprising:

initializing a timer associated with the block family;

responsive to detecting expiration of the timer, closing the block family.

20. The non-transitory computer-readable storage medium of claim 15 , wherein the processing device is further to perform operations comprising:

determining a threshold voltage offset associated with the block family; and

computing a modified threshold voltage by applying the threshold voltage offset to a base read level voltage associated with the memory device;

reading, using the modified threshold voltage, data from the first block of the block family.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 16, 2023
From: SHEPEREK, MICHAEL; MUCHHERLA, KISHORE KUMAR; KAYNAK, MUSTAFA N.; RAYAPROLU, VAMSI PAVAN; LIIKANEN, BRUCE A.; KOUDELE, LARRY J.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 063978/0178 →
Cited By (2)
US 12,572,281 US 12,591,475