Method for fabricating micro light-emitting diode display

1. A method for fabricating a micro light-emitting diode display, comprising:

disposing a plurality of micro light-emitting diodes on a carrier;

transferring the micro light-emitting diodes from the carrier to a display substrate and disposing the micro light-emitting diodes in a plurality of pixels of the display substrate;

subjecting the micro light-emitting diodes to a pre-bonding process to electrically connect the micro light-emitting diodes to the display substrate;

subjecting the micro light-emitting diodes pre-bonded to the display substrate to a first detection process, thereby identifying whether a faulty micro light-emitting diode is present or not; and

subjecting the micro light-emitting diodes to a main bonding process after the first detection process,

wherein the first detection process is an electrical detection, and the pixel having the faulty micro light-emitting diode is repaired after the faulty micro light-emitting diode is identified,

wherein the micro light-emitting diodes subjected to the main bonding process comprise both identified good micro light-emitting diodes and the repaired micro light-emitting diode.

2. The method as claimed in claim 1 , further comprising:

subjecting the micro light-emitting diodes on the carrier to a second detection process and identifying good micro light-emitting diodes of the micro light-emitting diodes on the carrier; and

transferring the good micro light-emitting diodes to the display substrate and subjecting the good micro light-emitting diodes to a pre-bonding process.

3. The method as claimed in claim 2 , wherein the second detection process is an optical detection.

4. The method as claimed in claim 1 , wherein the step of repairing the pixel having the faulty micro light-emitting diode comprises:

replacing the faulty micro light-emitting diode with a known good micro light-emitting diode.

5. The method as claimed in claim 1 , wherein the step of repairing the pixel having the faulty micro light-emitting diode comprises:

disconnecting an electrical connection between the faulty micro light-emitting diode and a control circuit of the display substrate; and

electrically connecting a redundant micro light-emitting diode to the control circuit of the display substrate.

6. The method as claimed in claim 1 , wherein there is a first bonding strength between the micro light-emitting diode and the display substrate after subjecting the micro light-emitting diode to a pre-bonding process, and there is a second bonding strength between the micro light-emitting diode and the display substrate after subjecting the micro light-emitting diode to the main bonding process, wherein the second bonding strength is greater than the first bonding strength.

7. The method as claimed in claim 1 , wherein the bonding temperature of the pre-bonding process is lower than the bonding temperature of the main bonding process.

8. The method as claimed in claim 7 , wherein the difference between the bonding temperature of the pre-bonding process and the bonding temperature of the main bonding process is greater than or equal to 100° C.

9. The method as claimed in claim 1 , wherein the process pressure of the pre-bonding process is lower than the process pressure of the main bonding process.

10. The method as claimed in claim 9 , wherein the difference between the process pressure of the pre-bonding process and the process pressure of the main bonding process is greater than or equal to 20 kgf/cm 2 .

11. The method as claimed in claim 1 , wherein the process period of the pre-bonding process is lower than the process period of the main bonding process.