IP Library Granted Patent US 11,218,129
Granted Patent B2
US 11,218,129 · App. 16/719,343 · Granted Jan 4, 2022

Impedance matching device and impedance matching method

Inventor: Tatsuya Morii (Osaka, JP)
Assignee: DAIHEN Corporation
H03H7/38H01J37/32183
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Quick Facts
Patent No.
US 11,218,129
App. No.
16/719,343
Granted
Jan 4, 2022
Kind
B2
Abstract

An impedance matching device 1 includes multiple capacitance elements and a control unit that controls on or off of semiconductor switches. The capacitance elements and respectively include a first capacitance element group and a second capacitance element group. The control unit updates the state of the first semiconductor switch included in the first capacitance element group with a first cycle until a predetermined time period elapses during which the state of the first semiconductor switch included in the first capacitance element group is maintained while the control unit updates the states of the semiconductor switch and respectively included in the first capacitance element group and the second capacitance element group with a second cycle longer than the first cycle after the predetermined time period elapses during which the state of the first semiconductor switch included in the first capacitance element group is maintained.

Claims (21)

1. An impedance matching device to achieve impedance matching between a high-frequency power source and a load, the impedance matching device comprising:

a variable capacitor including a plurality of capacitance elements connected in parallel, each of the plurality of capacitance elements respectively having a capacitor with one end connected to the high-frequency power source and a semiconductor switch connected in series to the capacitor, and

a control unit coupled to an impedance information detection unit located between the power source and the impedance matching device to generate tuning signals that control an on or off state of the each of semiconductor switches so as to match an output impedance of the high-frequency power source and an impedance of the load based on impedance information obtained by the impedance information detection unit,

wherein

the plurality of capacitance elements include a first capacitance element group and a second capacitance element group, the second capacitance element group including capacitors each having a capacitance smaller than a capacitance of one of the capacitors constituting the first capacitance element group, and

the control unit is configured to

start an impedance matching operation between the high-frequency power source and the load,

switch the on or off state of the semiconductor switches included in the first capacitance element group with a first cycle until the on or off state of the semiconductor switches included in the first capacitance element group is maintained for a predetermined time period, and

after the predetermined time period elapses, switch the on or off state of the semiconductor switches included in the first capacitance element group and switch the on or off state of the semiconductor switches included in the second capacitance element group with a second cycle longer than the first cycle.

2. The impedance matching device according to claim 1 , wherein

the first capacitance element group includes a plurality of the semiconductor switches, and

the control unit switches the on or off states of the semiconductor switches included in the first capacitance element group with the first cycle in a case where the on or off states of two or more semiconductor switches out of the plurality of the semiconductor switches included in the first capacitance element group are changed during one update cycle after switching with the second cycle.

3. The impedance matching device according to claim 1 , wherein

the second capacitance element group includes a plurality of the semiconductor switches, and

the control unit maintains the on or off states of the semiconductor switches included in the second capacitance element group at a time of switching with the first cycle.

4. The impedance matching device according to claim 1 , wherein the predetermined time period is a time period at least three times longer than the first cycle.

5. The impedance matching device according to claim 1 , wherein a capacitance of any one of the capacitors included in the first capacitance element group is larger than a total value of capacitances of all the capacitors included in the second capacitance element group.

6. An impedance matching method of achieving impedance matching between a high-frequency power source and a load by a variable capacitor provided between the high-frequency power source and the load, the variable capacitor including a first capacitance element group including a capacitor and a semiconductor switch and a second capacitance element group including a capacitor having a capacitance smaller than a capacitance of the capacitor of the first capacitance element group and a semiconductor switch, the method comprising:

starting an impedance matching operation between the high-frequency power source and the load,

switching the on or off state of the semiconductor switch included in the first capacitance element group with a first cycle until the on or off state of the semiconductor switch included in the first capacitance element group is maintained for a predetermined time period, and

after the predetermined time period elapses, switching the on or off state of the semiconductor switch included in the first capacitance element group and switching the on or off state of the semiconductor switch included in the second capacitance element group with a second cycle longer than the first cycle.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2019
From: MORII, TATSUYA
To: DAIHEN CORPORATION
Reel/Frame 051389/0630 →
Priority Claims (1)
JP JP2018-243191 · Dec 26, 2018 · national
Continuity (1)
Related Publication 20200212868A1 · Jul 2, 2020
Cited By (2)
US 12,444,572 US 12,586,760