IP Library Granted Patent US 11,218,789
Granted Patent B1
US 11,218,789 · App. 16/988,966 · Granted Jan 4, 2022

Microphone-mounted earphone

Inventors: Ju Heon Ko (Gyeonggi-do, KR); Jong Won Lee (Incheon, KR); Byung Il Min (Gyeonggi-do, KR); Yun Uk Ha (Incheon, KR); Jeong Kwon Park (Gyeonggi-do, KR); Yeong Jae Lee (Gyeonggi-do, KR)
Assignee: ALMUS Corp.
H04R1/086H04R1/1016H04R1/1075
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Quick Facts
Patent No.
US 11,218,789
App. No.
16/988,966
Granted
Jan 4, 2022
Kind
B1
Abstract

Disclosed is a microphone-mounted earphone including a housing, a speaker unit accommodated in the housing, and a microphone. Here, the housing includes a sound emission path formed in front of the speaker unit to emit a sound generated by the speaker unit toward the outside. The housing includes a microphone installation groove recessed from an outer surface of a front of the speaker unit toward the sound emission path. The microphone is installed in the microphone installation groove. Also, the microphone-mounted earphone further includes a cover configured to cover the microphone installation groove not to allow the microphone to be exposed outward.

Claims (22)

1. A microphone-mounted earphone comprising:

a housing;

a speaker unit accommodated in the housing;

a microphone; and

a substrate on which the microphone is mounted,

wherein the housing comprises a sound emission path formed in front of the speaker unit to emit a sound generated by the speaker unit toward the outside,

wherein the housing comprises a microphone installation groove recessed from an outer surface of a front of the speaker unit toward the sound emission path,

wherein the microphone is installed in the microphone installation groove,

wherein the substrate is mounted on a bottom surface of the microphone installation groove, and

the microphone-mounted earphone further comprising a cover configured to cover the microphone installation groove not to allow the microphone to be exposed outward.

2. The microphone-mounted earphone of claim 1 , wherein a microphone hole of the microphone is disposed toward the substrate,

wherein a first opening is formed in the substrate at a position corresponding to the microphone hole, and

wherein a second opening is formed in the bottom surface to allow the sound emission path and the first opening to communicate with each other.

3. The microphone-mounted earphone of claim 2 , wherein the first opening and the second opening are disposed at positions which disaccord with each other, and

wherein a communication groove is formed in the bottom surface from the second opening to a position corresponding to the first opening to allow the second opening and the first opening to communicate with each other.

4. The microphone-mounted earphone of claim 3 , wherein the communication groove is formed to have an L shape.

5. The microphone-mounted earphone of claim 2 , wherein a third opening is formed in the bottom surface to allow the sound emission path and an internal space of the microphone installation groove to communicate with each other, and

wherein a conduit is formed in the housing to allow the internal space of the microphone installation groove and a space in the rear of the speaker unit in the housing to communicate with each other.

6. The microphone-mounted earphone of claim 5 , wherein the conduit is formed along an outside of the speaker unit from an inner surface, which faces a front of the earphone, among inner surfaces of the microphone installation groove.

7. The microphone-mounted earphone of claim 2 , wherein a third opening is formed in the bottom surface to allow the sound emission path and an internal space of the microphone installation groove to communicate with each other, and

wherein a fourth opening is formed in the cover to allow the internal space of the microphone installation groove to communicate with the outside.

8. The microphone-mounted earphone of claim 7 , further comprising a mesh member configured to cover the fourth opening.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2020
From: KO, JU HEON; LEE, JONG WON; MIN, BYUNG II; HA, YUN UK; PARK, JEONG KWON; LEE, YEONG JAE
To: ALMUS CORP.
Reel/Frame 053444/0001 →
Priority Claims (1)
KR 10-2020-0081778 · Jul 2, 2020 · national
Cited By (1)
US 12,685,838