Vacuum processing apparatus
A magnet unit for a magnetron sputtering apparatus is disposed above the target has: a yoke made of magnetic material and is disposed to lie opposite to the target; and plural pieces of magnets disposed on a lower surface of the yoke, wherein a leakage magnetic field in which a line passing through a position where the vertical component of the magnetic field becomes zero is closed in an endless manner, is caused to locally act on such a lower space of the target as is positioned between the center of the target and a periphery thereof, the magnet unit being driven for rotation about the center of the target. In a predetermined position of the yoke there is formed a recessed groove in a circumferentially elongated manner along an imaginary circle with the center of the target serving as a center.
1. A vacuum processing apparatus, comprising;
a vacuum chamber capable of forming therein a vacuum atmosphere, and a stage inside the vacuum chamber, the stage being adapted to dispose thereon a to-be-processed substrate,
the stage having a base and a hot plate disposed on the base so as to enable to heat the to-be-processed substrate; and
a platen ring and a deposition preventing plate both being made of metal and surrounding the hot plate with a predetermined clearance therebetween,
wherein a first surface portion of the platen ring, the first surface portion lying opposite to the hot plate is made up of a low-emissivity layer having a lowered emissivity as a result of a surface treatment to a parent metal of the platen ring,
wherein the deposition preventing plate has a portion which lies opposite to the platen ring while keeping a clearance to the platen ring, and
wherein a second surface portion of the platen ring, the second surface portion lying opposite to the deposition preventing plate, is made up of a high-emissivity layer having an emissivity higher than that of the low-emissivity layer.
2. The vacuum processing apparatus according to claim 1 , wherein a surface of the portion of the deposition preventing plate, the surface lying opposite to the platen ring, has an emissivity equivalent to that of the low-emissivity layer of the platen ring.
3. The vacuum processing apparatus according to claim 1 , wherein the emissivity of the low-emissivity layer is below 0.3.
4. The vacuum processing apparatus according to claim 1 , wherein the emissivity of the high-emissivity layer is above 0.5.