IP Library Granted Patent US 11,242,607
Granted Patent B2
US 11,242,607 · App. 16/982,262 · Granted Feb 8, 2022

Metal material with thermodynamic anisotropy and a method of preparing the same

Inventors: Yun Zhang (Suzhou, CN); Jing Wang (Suzhou, CN); Peipei Dong (Wujiang, CN); Xingxing Zhang (Suzhou, CN)
Assignee: SUZHOU SHINHAO MATERIALS LLC
C25D3/38B32B2307/536B32B2307/706Y10T428/12431
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Quick Facts
Patent No.
US 11,242,607
App. No.
16/982,262
Granted
Feb 8, 2022
Kind
B2
Abstract

A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K −1 ; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K −1 ; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10-6-1000×10-6 K −1 . A method for preparing a metal material having thermodynamic anisotropy is also disclosed.

Claims (12)

1. A metal material having thermodynamic anisotropy comprising:

an X-axis hardness of 160-180 HV, an X-axis thermal expansion coefficient of 5×10 −6 -100×10 −6 K −1 ;

a Y-axis hardness of 160-180 HV, a Y-axis thermal expansion coefficient of 5×10 −6 -100×10 −6 K −1 ; and

a Z-axis hardness of 180-250 HV, a Z-axis thermal expansion coefficient of 50×10 −6 -1000×10 −6 K −1 ,

wherein the metal material is prepared by a process that includes the following steps:

preparing an electroplating base solution that includes a copper sulfate solution having a divalent copper ion concentration of 40 g/L, a sulfuric acid solution having a sulfuric acid concentration of 120 g/L, and a hydrochloric acid having a chloride ion concentration of 50 ppm;

adding an organosulfate having a concentration of 4 mL/L, polyethylene glycol having a concentration of 15 ml/L, and a quaternary ammonium salt having a concentration of 35 mL/L to the electroplating base solution; and

conducting electroplating at a current density of 5 A/dm 2 for 40 minutes to obtain the metal material,

wherein the organosulfate is sodium lauryl sulfate, disodium 3,3-dithiobispropane-sulphonate, or 3, 3′-dithiobispropanesulfonic acid and the quaternary ammonium salt is

2. The metal material of claim 1 , wherein the metal material is selected from the group consisting of copper, tin, silver, nickel, chromium, cobalt, and an alloy thereof.

3. The metal material of claim 1 , wherein the X-axis hardness is 140-150 HV, the Y-axis hardness is 140-150 HV, and the Z-axis hardness is 190-220 HV.

4. The metal material of claim 1 , wherein the X-axis thermal expansion coefficient is 5×10 −6 -10×10 −6 K −1 , the Y-axis thermal expansion coefficient is 5×10 −6 -10×10 −6 K −1 , and the Z-axis thermal expansion coefficient is 80×10 −6 -120×10 −6 K −1 .

Assignments (2)
CHANGE OF NAME Recorded Jul 1, 2026
From: SHINHAO MATERIALS LLC
To: UMICORE (SUZHOU) SEMICONDUCTOR MATERIALS CO. LTD.
Reel/Frame 075150/0135 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2020
From: ZHANG, YUN; WANG, JING; DONG, PEIPEI; ZHANG, XINGXING
To: SUZHOU SHINHAO MATERIALS LLC
Reel/Frame 053817/0662 →
Priority Claims (1)
CN 201811090322.4 · Sep 18, 2018 · national
Continuity (1)
Related Publication 20210017660A1 · Jan 21, 2021