Micro device with through PCB cooling
Micro devices having enhanced through printed circuit board (PCB) heat transfer are provided. In one example, a micro device is provided that includes a PCB, a thermal management device, a chip package, a bracket, and a plurality of extra-package heat conductors. The chip package has a first side facing the thermal management device and a second side mounted to a first side of the PCB. The bracket is disposed on a second side of the PCB that faces away from the chip package. The plurality of extra-package heat conductors are disposed laterally outward of the chip package and provide at least a portion of a thermally conductive heat transfer path between the bracket and the thermal management device through the PCB.
1. A micro device comprising:
a printed circuit board (PCB);
a thermal management device;
a chip package having a first side facing the thermal management device and a second side mounted to a first side of the PCB;
a bracket on a second side of the PCB that faces away from the chip package; and
a plurality of extra-package heat conductors disposed laterally outward of the chip package, the plurality of extra-package heat conductors providing at least a portion of a thermally conductive heat transfer path between the bracket and the thermal management device through the PCB.
2. The micro device of claim 1 , wherein the thermal management device further comprises at least one or both of:
an active cooling device having an inlet port, internal channels and an outlet port configured to flow a heat transfer fluid therethrough; and
a passive cooling device.
3. The micro device of claim 1 , wherein the thermal management device further comprises:
a heat generating device disposed between the bracket and the PCB.
4. The micro device of claim 1 , wherein the thermal management device further comprises:
a plate body disposed directly over the chip package; and
plate tabs extending from the plate body laterally outward of the chip package, each plate tab aligned with a respective one of the plurality of extra-package heat conductors.
5. The micro device of claim 4 further comprising:
spring loaded fasteners coupling the plate tabs to the bracket.
6. The micro device of claim 4 , wherein at least a first plate tab of the plate tabs further comprises:
a pocket receiving an end of one of the plurality of extra-package heat conductors.
7. The micro device of claim 1 , wherein the bracket further comprises:
a bracket body disposed directly below the chip package; and
bracket tabs extending from the bracket body laterally outward of the chip package, each bracket tab aligned with a respective one of the plurality of extra-package heat conductors.
8. The micro device of claim 7 , wherein at least a first bracket tab of the bracket tabs further comprises:
a pocket receiving an end of one of the plurality of extra-package heat conductors.
9. The micro device of claim 1 , wherein a first extra-package heat conductor the plurality of extra-package heat conductors further comprises:
a first end that is surface mounted to the PCB.
10. The micro device of claim 1 , wherein a first extra-package heat conductor the plurality of extra-package heat conductors extends through an aperture formed through the PCB.
11. The micro device of claim 1 , wherein one end of a first extra-package heat conductor the plurality of extra-package heat conductors is mechanically attached to one of the thermal management device or the bracket.
12. The micro device of claim 1 , wherein one end of a first extra-package heat conductor the plurality of extra-package heat conductors has surface features that are interleaved with mating surface features of one of the thermal management device or the bracket.
13. A micro device comprising:
a printed circuit board (PCB);
a chip package mounted to the PCB;
a thermal management device sandwiching the chip package against the PCB, the thermal management device comprising a cooling plate and a least or both of:
an active cooling device disposed on the cooling plate, the active cooling device having an inlet port, internal channels and an outlet port configured to flow a heat transfer fluid therethrough;
one or more passive cooling devices disposed on the cooling plate;
a bracket on a second side of the PCB that faces away from the chip package;
a heat generating device disposed between the bracket and the PCB; and
a plurality of extra-package heat conductors disposed laterally outward of the chip package, the plurality of extra-package heat conductors providing at least a portion of a thermally conductive heat transfer path between the bracket and the thermal management device through the PCB.
14. The micro device of claim 13 , wherein the passive cooling device further comprises:
a plate body disposed directly over the chip package; and
plate tabs extending from the plate body laterally outward of the chip package, each plate tab aligned with a respective one of the plurality of extra-package heat conductors and in contact with the one or more passive cooling devices.
15. The micro device of claim 14 , wherein at least a first plate tab of the plate tabs further comprises:
a pocket receiving an end of one of the plurality of extra-package heat conductors.
16. The micro device of claim 13 , wherein the bracket further comprises:
a bracket body disposed directly below the chip package; and
bracket tabs extending from the bracket body laterally outward of the chip package, each bracket tab aligned with a respective one of the plurality of extra-package heat conductors.
17. The micro device of claim 16 , wherein at least a first bracket tab of the bracket tabs further comprises:
a pocket receiving an end of one of the plurality of extra-package heat conductors.
18. The micro device of claim 13 , wherein a first extra-package heat conductor the plurality of extra-package heat conductors is last least one or more of surface mounted to the PCB, extending through an aperture formed through the PCB, or mechanically attached to one of the thermal management device or the bracket.
19. A micro device comprising:
a printed circuit board (PCB);
a thermal management device;
a chip package having a first side facing the thermal management device and a second side mounted to a first side of the PCB;
a bracket on a second side of the PCB that faces away from the chip package;
a heat generating device disposed between the bracket and the PCB; and
a first plurality of extra-package heat conductors disposed laterally outward of the chip package and surface mounted to the PCB, the first plurality of extra-package heat conductors providing at least a portion of a thermally conductive heat transfer path between the bracket and the thermal management device through the PCB.
20. The micro device of claim 19 further comprising:
a second plurality of extra-package heat conductors disposed laterally outward of the chip package, the second plurality of extra-package heat conductors contacting at least one of the bracket and the thermal management device, each of the second plurality of extra-package heat conductors respectively aligned across the PCB with a respective one of the first plurality of extra-package heat conductors.