Structural adhesives

1. An adhesive formulation comprising:

i) an adduct of an epoxy resin and an elastomer, wherein the adhesive formulation contains from about 7% to about 20% by weight of the adduct based on the adhesive formulation;

ii) a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product;

iii) a core/shell polymer, wherein the adhesive formulation contains from 5% to 30% by weight of the core/shell polymer;

iv) a curing agent; and

v) one or more additional epoxy resins;

wherein the adhesive formulation includes between about 55% by weight and about 70% by weight total epoxy resin, wherein the total epoxy resin is the liquid epoxy resin of the phenoxy epoxy hybrid resin and the one or more additional epoxy resins;

wherein the adhesive formulation is a liquid or a paste at room temperature;

wherein the adhesive formulation contains between 3% to 10% by weight of the phenoxy resin so that the adhesive formulation is pumpable;

wherein the adhesive formulation functions over a temperature range of about −40° C. to about 90° C.; and

wherein the adhesive formulation has a strength when cured in the wedge impact test at −40° C. of greater than 20 N/mm.

2. The adhesive formulation according to claim 1 , wherein the formulation contains from about 7% to about 15% by weight of the adduct based on the adhesive formulation.

3. The adhesive formulation according to claim 1 , wherein the adduct includes about 1:5 to 5:1 parts of epoxy to elastomer.

4. The adhesive formulation according to claim 1 , wherein the elastomer in the adduct is selected from a group consisting of: natural rubber, styrene-butadiene rubber, polyisoprene, polyisobutylene, polybutadiene, isoprene-butadiene copolymer, neoprene, nitrile rubber, butyl rubber, polysulfide elastomer, acrylic elastomer, acrylonitrile elastomers, silicone rubber, polysiloxanes, polyester rubber, diisocyanate-linked condensation elastomer, ethylene-propylene diene rubbers, chlorosulphonated polyethylene, fluorinated hydrocarbons, and any combination thereof.

5. The adhesive formulation according to claim 4 , wherein the adduct of the epoxy resin and the elastomer is derived from a butadiene acrylonitrile rubber.

6. The adhesive formulation according to claim 1 , wherein the phenoxy resin is of the formula

where n is from 30 to 100.

7. The adhesive formulation according to claim 1 , wherein the formulation provides added strength to metal welds including weld flanges.

8. The adhesive formulation according to claim 1 , wherein the core/shell polymer has a ductile core and a rigid shell which is compatible with the other components of the formulation.

9. The adhesive formulation according to claim 1 , in which the core/shell polymer includes materials selected from a group consisting of: styrenics, acrylonitriles, acrylates, acetates, polyamides, polyethylenes, and any combination thereof.

10. The adhesive formulation according to claim 1 , wherein the core/shell polymer is a graft copolymer in which styrene, acrylonitrile, or methyl methacrylate, are grafted onto a core polymer made from polymers of soft or elastomeric compounds.

11. The adhesive formulation according to claim 10 , wherein the core polymer includes other copolymerizable containing compounds, selected from styrene, vinyl acetate, methyl methacrylate, butadiene, and isoprene.

12. The adhesive formulation according to claim 10 , wherein the core polymer includes a cross linking monomer having two or more nonconjugated double bonds.

13. The adhesive formulation according to claim 10 , wherein a shell portion of the core/shell polymer is polymerized from alkyl acrylates and/or methacrylates.

14. The adhesive formulation according to claim 1 , wherein the curing agent is selected from aliphatic or aromatic amines or their respective adducts, amidoamines, polyamides, cycloaliphatic amines, anhydrides, polycarboxylic polyesters, isocyanates, phenol-based resins, and mixtures thereof.

15. The adhesive formulation according to claim 14 , in which the curing agent is selected from modified and unmodified polyamines or polyamides.

16. The adhesive formulation according to claim 1 , wherein the formulation contains between 7% and 15% by weight of the liquid epoxy resin of the phenoxy epoxy hybrid resin.

17. The adhesive formulation according to claim 1 , wherein the formulation contains one or more liquid poly sulfides.

18. The adhesive formulation according to claim 1 , comprising from about 1% to about 10% by weight of the curing agent.

19. The adhesive formulation according to claim 18 , comprising about 0.2% to about 3% by weight of a cure accelerator, about 0.1% to about 50% by weight mineral filler, and about 0.1% to about 3.0% by weight clay and/or silica.

20. The adhesive formulation according to claim 15 , wherein the curing agent is selected from one or more of triethylenetetramine, diethylenetriamine tetraethylenepentamine, cyanoguanidine, and dicyandiamides.

21. An adhesive formulation comprising:

i) an adduct of an epoxy resin and an elastomer, wherein the formulation contains from about 7% to about 15% by weight of the adduct based on the adhesive formulation, and wherein the adduct includes about 1:5 to 5:1 parts of epoxy to elastomer;

ii) a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product;

iii) a core/shell polymer, wherein the adhesive formulation contains from 5% to 30% by weight of the core/shell polymer;

iv) a curing agent; and

v) one or more additional epoxy resins;

wherein the adhesive formulation includes between about 55% by weight and about 70% by weight total epoxy resin, wherein the total epoxy resin is the liquid epoxy resin of the phenoxy epoxy hybrid resin and the one or more additional epoxy resins;

wherein the adhesive formulation is a liquid or a paste at room temperature;

wherein the adhesive formulation contains between 3% to 10% by weight of the phenoxy resin so that the adhesive formulation is pumpable;

wherein the adhesive formulation functions over a temperature range of about −40° C. to about 90° C.; and

wherein the adhesive formulation has a strength when cured in the wedge impact test at −40° C. of greater than 20 N/mm.