Chip form ultracapacitor
An energy storage apparatus suitable for mounting on a printed circuit board using a solder reflow process is disclosed. In some embodiments, the apparatus includes: a sealed housing body (e.g., a lower body with a lid attached thereto) including a positive internal contact and a negative internal contact (e.g., metallic contact pads) disposed within the body and each respectively in electrical communication with a positive external contact and a negative external contact. Each of the external contacts provide electrical communication to the exterior of the body, and may be disposed on an external surface of the body. An electric double layer capacitor (EDLC) (also referred to herein as an “ultracapacitor” or “supercapacitor”) energy storage cell is disposed within a cavity in the body including a stack of alternating electrode layers and electrically insulating separator layers. An electrolyte is disposed within the cavity and wets the electrode layers. A positive lead electrically connects a first group of one or more of the electrode layers to the positive internal contact; and a negative lead electrically connects a second group of one or more of the electrode layers to the negative internal contact.
1. An energy storage apparatus suitable for mounting on a printed circuit board using a solder reflow process, the apparatus comprising:
a sealed housing body comprising a positive internal contact and a negative internal contact each disposed within the body and each respectively in electrical communication with a positive external contact and a negative external, each of the external contacts providing electrical communication to the exterior of the body;
an electric double layer capacitor (EDLC) energy storage cell disposed within a cavity in the body comprising a stack of alternating electrode layers and electrically insulating separator layers;
an electrolyte disposed within the cavity and wetting the electrode layers;
a positive lead electrically connecting a first group of one or more of the electrode layers to the positive internal contact; and
a negative lead electrically connecting a second group of one or more of the electrode layers to the negative internal contact; wherein each of the electrode layers comprises an energy storage media that is substantially free from binding agents and wherein the energy storage media comprises a network of carbon nanotubes defining void spaces; wherein a carbonaceous material is located in the void spaces and bound by the network of carbon nanotubes.
2. The apparatus of claim 1 , wherein at least one electrode layer comprises a double-sided electrode layer having energy storage media disposed on opposing surfaces of a conductive current collector layer.
3. The apparatus of claim 1 , wherein surfaces of the energy storage cell in physical contact with body consist of electrically insulating material.
4. The apparatus of claim 1 , wherein each of the electrode layers comprises a conductive tab attached to one of the positive lead and the negative lead.
5. The apparatus of claim 1 , further comprising a corrosion prevention feature located proximal to one of the internal contacts and configured to limit electrochemical reaction between said internal contact and the electrolyte during operation of the apparatus.
6. The apparatus of claim 5 , wherein:
the internal contact comprises a first material having a relatively high electrochemical activity with the electrolyte;
the corrosion prevention feature comprises a protective layer of a second material having a relatively lower electrochemical activity with the electrolyte than the first material, said protective layer disposed to prevent contact between the first material and the electrolyte.
7. The apparatus of claim 6 , wherein the protective layer comprises a layer of sealant.
8. The apparatus of claim 6 , wherein the protective layer comprises a metallic layer disposed on a surface of the first material.
9. The apparatus of claim 6 , wherein the protective layer comprises a metallic layer disposed on a surface of the first material and a sealant layer disposed on the metallic layer.
10. The apparatus of claim 9 , wherein in the metallic layer comprises a metallic shim covering at least a portion of the internal contact and secured by the sealant layer.
11. The apparatus of claim 5 , wherein an interior surface of the body comprises a recessed portion configured to receive at least a portion of the corrosion prevention feature.
12. The apparatus of claim 5 , wherein a portion of the positive or negative lead extends through the corrosion prevention feature to connect to one of the internal contacts.
13. The apparatus of claim 5 , wherein the corrosion prevention feature comprises an aluminum metallic layer.
14. The apparatus of claim 5 , wherein the corrosion prevention feature comprises an epoxy sealant.
15. A method of making an energy storage apparatus suitable for mounting on a printed circuit board using a solder reflow process, the method comprising:
forming an electric double layer capacitor (EDLC) energy storage cell comprising a stack of alternating electrode layers and electrically insulating separator layers;
disposing the energy storage cell within a housing body, the body comprising a positive internal contact and a negative internal contact disposed within the body;
at least partially filling the body with electrolyte to wet the electrode layers;
electrically connecting a positive lead from a first group of one or more of the electrode layers to the positive internal contact;
electrically connecting a negative lead from a second group of one or more of the electrode layers to the negative internal contact; wherein each of the electrode layers comprises an energy storage media that is substantially free from binding agents and wherein the energy storage media comprises a network of carbon nanotubes defining void spaces; wherein a carbonaceous material is located in the void spaces and bound by the network of carbon nanotubes; and
sealing the housing body with the energy storage cell disposed therein.
16. The method of claim 15 , wherein sealing the housing body comprises hermetically sealing the housing body.
17. The method of providing energy to a device mounted on a printed circuit board comprising:
mounting the apparatus of claim 1 to the printed circuit board using a solder reflow process; and
repetitively charging and discharging the apparatus at an operating voltage and operating temperature to provide energy to a device;
wherein the operating voltage is at least 2 V and the operating temperature is at least 65° C.
18. The method of claim 17 , comprising repetitively charging and discharging the apparatus at an operating voltage and operating temperature to provide energy to a device for at least 2,000 hours while the apparatus exhibits a capacitance degradation of less than 30% and an equivalent series resistance increase of less than 100%.
19. An energy storage apparatus suitable for mounting on a printed circuit board using a solder reflow process, the apparatus comprising:
a sealed housing body comprising a positive internal contact and a negative internal contact each disposed within the body and each respectively in electrical communication with a positive external contact and a negative external, each of the external contacts providing electrical communication to the exterior of the body;
an electric double layer capacitor (EDLC) energy storage cell disposed within a cavity in the body comprising a stack of alternating electrode layers and electrically insulating separator layers;
an electrolyte disposed within the cavity and wetting the electrode layers;
a positive lead electrically connecting a first group of one or more of the electrode layers to the positive internal contact; and
a negative lead electrically connecting a second group of one or more of the electrode layers to the negative internal contact; and
a corrosion prevention feature located proximal to one of the internal contacts and configured to limit electrochemical reaction between said internal contact and the electrolyte during operation of the apparatus.
20. The apparatus of claim 19 , wherein:
the internal contact comprises a first material having a relatively high electrochemical activity with the electrolyte;
the corrosion prevention feature comprises a protective layer of a second material having a relatively lower electrochemical activity with the electrolyte than the first material, said protective layer disposed to prevent contact between the first material and the electrolyte.
21. The apparatus of claim 20 , wherein the protective layer comprises a layer of sealant.
22. The apparatus of claim 20 , wherein the protective layer comprises a metallic layer disposed on a surface of the first material.
23. The apparatus of claim 20 , wherein the protective layer comprises a metallic layer disposed on a surface of the first material and a sealant layer disposed on the metallic layer.
24. The apparatus of claim 23 , wherein in the metallic layer comprises a metallic shim covering at least a portion of the internal contact and secured by the sealant layer.
25. The apparatus of claim 19 , wherein an interior surface of the body comprises a recessed portion configured to receive at least a portion of the corrosion prevention feature.
26. The apparatus of claim 19 , wherein a portion of the positive or negative lead extends through the corrosion prevention feature to connect to one of the internal contacts.
27. The apparatus of claim 19 , wherein the corrosion prevention feature comprises an aluminum metallic layer.
28. The apparatus of claim 19 , wherein the corrosion prevention feature comprises an epoxy sealant.