Source structure of three-dimensional memory device and method for forming the same
Embodiments of source structure of a three-dimensional (3D) memory device and method for forming the source structure of the 3D memory device are disclosed. In an example, a NAND memory device includes a substrate, an alternating conductor/dielectric stack, a NAND string, a source conductor layer, and a source contact. The alternating conductor/dielectric stack includes a plurality of conductor/dielectric pairs above the substrate. The NAND string extends vertically through the alternating conductor/dielectric stack. The source conductor layer is above the alternating conductor/dielectric stack and is in contact with an end of the NAND string. The source contact includes an end in contact with the source conductor layer. The NAND string is electrically connected to the source contact by the source conductor layer. In some embodiments, the source conductor layer includes one or more conduction regions each including one or more of a metal, a metal alloy, and a metal silicide.
1. A method for forming a three-dimensional (3D) memory device, comprising:
forming an alternating conductor/dielectric stack on a first substrate;
forming, on a first side of the first substrate, a plurality of memory strings extending vertically through the alternating conductor/dielectric stack;
thinning the first substrate from a second side of the first substrate;
forming, on the second side of the thinned first substrate, a metal layer; and
causing a reaction between at least part of the metal layer and the thinned first substrate to form a source conductor layer in the thinned first substrate.
2. The method of claim 1 , further comprising patterning the first substrate to form an isolation region.
3. The method of claim 1 , further comprising patterning the source conductor layer to form an isolation region in the source conductor layer.
4. The method of claim 1 , further comprising:
forming a first interconnect layer above the plurality of memory strings on the first substrate;
forming, on a second substrate, a peripheral device;
forming a second interconnect layer above the peripheral device, on the second substrate; and
bonding the first substrate and the second substrate, so that the first interconnect layer is above and in contact with the second interconnect layer.