Apparatus for stressing semiconductor substrates

1. An apparatus for stressing a semiconductor substrate, the substrate having a central axis, a front surface and a back surface which are generally perpendicular to the central axis, and a peripheral edge extending from the front surface to the back surface, the apparatus comprising:

a chamber,

a heater for heating the chamber, the heater comprising radiant heating lamps, resistance heaters or inductive heaters,

a substrate holder mounted in the chamber, the holder including:

a generally planar back support,

a press for receiving and compressing the substrate, the press adapted to contact the peripheral edge of the semiconductor substrate and generally uniformly compress the substrate radially inward from its peripheral edge toward its central axis, the press being moveable radially inward relative the substrate to compress the substrate.

2. The apparatus as set forth in claim 1 wherein the substrate is generally circular and the press includes a generally circular opening for receiving the substrate.

3. The apparatus as set forth in claim 2 wherein the press includes a plurality of arc-shaped segments forming the opening for receiving the substrate, the segments being movable inwardly to compress the substrate.

4. The apparatus as set forth in claim 2 wherein the press is made of a material that expands at a lesser rate than that of the substrate such that heat applied to the substrate and the press will cause compression of the substrate.

5. The apparatus as set forth in claim 2 in combination with the substrate, the substrate including a coating disposed adjacent the peripheral edge.

6. The apparatus as set forth in claim 1 wherein the press is made of a material that expands at a lesser rate than that of the substrate such that heat applied to the substrate and the press will cause compression of the substrate.

7. The apparatus as set forth in claim 1 in combination with the substrate, the substrate including a coating disposed adjacent the peripheral edge.

8. The apparatus as set forth in claim 1 wherein the chamber is an epitaxial chamber for applying an epitaxial layer.

9. The apparatus as set forth in claim 1 wherein the press is configured to continuously encircle the substrate.

10. The apparatus as set forth in claim 1 further comprising a pressure modulator for causing a pressure differential across the substrate sufficient to exert stress on the substrate,

the substrate holder further including:

a front ring and a back ring,

each ring including an annular support for contacting the substrate at a discrete radial position adjacent a peripheral edge of the substrate, the front ring adapted to contact the front surface and the back ring adapted to contact the back surface of the substrate.

11. The apparatus as set forth in claim 10 wherein the front and back rings are adapted to form a seal with the substrate to facilitate causing a pressure differential across the substrate.

12. The apparatus as set forth in claim 10 wherein the annular support includes a substantially sealed cavity and a single vent, the support adapted to contact one of the surfaces of the substrate and form a seal therewith, the vent enabling a vacuum to be pulled through the cavity for exerting stress on the substrate.

13. The apparatus as set forth in claim 1 wherein the heater comprises radiant heating lamps disposed above and below the chamber.