Ceramic copper circuit board and method for manufacturing the same
View Patent ↗A ceramic copper circuit board according to an embodiment includes a ceramic substrate and a first copper part. The first copper part is bonded at a first surface of the ceramic substrate via a first brazing material part. The thickness of the first copper part is 0.6 mm or more. The side surface of the first copper part includes a first sloped portion. The width of the first sloped portion is not more than 0.5 times the thickness of the first copper part. The first brazing material part includes a first jutting portion jutting from the end portion of the first sloped portion. The length of the first jutting portion is not less than 0 μm and not more than 200 μm. The contact angle between the first jutting portion and the first sloped portion is 65° or less.
1. A ceramic copper circuit board, comprising:
a ceramic substrate; and
a first copper part bonded to a first surface of the ceramic substrate via a first brazing material part,
a thickness of the first copper part being 0.6 mm or more,
a side surface of the first copper part including a first sloped portion,
a width of the first sloped portion being not more than 0.5 times the thickness of the first copper part,
the first brazing material part including a first jutting portion jutting from an end portion of the first sloped portion,
a length of the first jutting portion being not less than 0 μm and not more than 200 μm,
a contact angle between the first jutting portion and the first sloped portion being not less than 5° and not more than 65°, and
an angle of an upper end portion of the first sloped portion being less than 50°.
2. The ceramic copper circuit board according to claim 1 , wherein
the contact angle is not more than 60°.
3. The ceramic copper circuit board according to claim 1 , wherein
the length of the first jutting portion is greater than 0 μm and not more than 200 μm.
4. The ceramic copper circuit board according to claim 1 , wherein
the first brazing material part includes silver, copper, and an active metal.
5. The ceramic copper circuit board according to claim 1 , wherein
the thickness of the first copper part is 0.8 mm or more,
the ceramic substrate is a silicon nitride substrate, and
a thickness of the ceramic substrate is 0.4 mm or less.
6. The ceramic copper circuit board according to claim 1 , further comprising:
a second copper part bonded to the first surface via a second brazing material part,
the second copper part being separated from the first copper part in a first direction along the first surface,
a distance in the first direction between at least a portion of the first copper part and at least a portion of the second copper part being 2 mm or less.
7. The ceramic copper circuit board according to claim 1 , wherein
the contact angle is not less than 5° and not more than 60°,
the length of the first jutting portion is greater than 0 μm and not more than 200 μm,
the thickness of the first copper part is 0.8 mm or more,
the ceramic substrate is a silicon nitride substrate, and
a thickness of the ceramic substrate is 0.4 mm or less.
8. The ceramic copper circuit board according to claim 1 , wherein
the length of the first jutting portion is greater than 40 μm and not more than 200 μm.