Method for forming biochips and biochips with non-organic landings for improved thermal budget
The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates.
1. A biochip comprising:
a transparent substrate;
a patterned passivating layer on the transparent substrate;
a patterned adhesion layer on the transparent substrate;
a second substrate bonded to the transparent substrate, the second substrate having a plurality of first landings, wherein the biochip comprises a microfluidic channel having the patterned adhesion layer as a sidewall, wherein the microfluidic channel comprises:
a first opening extending fully through the second substrate, the first opening being surrounded by a material of the second substrate;
a second opening extending fully through the second substrate, the second opening being different from the first opening and being surrounded by the material of the second substrate; and
a connecting portion connecting the first opening and the second opening, wherein each opening into the connecting portion is surrounded by the material of the second substrate in a top down view, wherein the first landings overlie an exposed portion of the transparent substrate.
2. The biochip of claim 1 , further comprising second landings embedded within the patterned passivating layer.
3. The biochip of claim 2 , wherein the first landings have a first density and the second landings have a second density different from the first density.
4. The biochip of claim 2 , wherein the first landings comprise a first material and the second landings comprise a second material different from the first material.
5. The biochip of claim 1 , wherein the second substrate has a thickness of between about 100 nm and about 200 nm.
6. The biochip of claim 1 , wherein the first landings are non-organic.
7. The biochip of claim 6 , wherein the first landings comprise a metal.
8. A biochip comprising:
a transparent substrate;
a patterned passivating layer on the transparent substrate;
a patterned adhesion layer to the transparent substrate;
a second substrate bonded to the transparent substrate, the second substrate having a plurality of first landings, wherein the biochip comprises a microfluidic channel having the patterned adhesion layer as a sidewall, wherein the second substrate is a sensing wafer, wherein the microfluidic channel comprises:
a first opening extending fully through the second substrate, the first opening being surrounded by a material of the second substrate;
a second opening extending fully through the second substrate, the second opening being different from the first opening and being surrounded by the material of the second substrate; and
a connecting portion connecting the first opening and the second opening, wherein each opening into the connecting portion is surrounded by the material of the second substrate in a top down view, wherein the first landings overlie an exposed portion of the transparent substrate.
9. The biochip of claim 8 , wherein the sensing wafer further comprises a temperature sensor.
10. The biochip of claim 9 , wherein the sensing wafer further comprises a heater.
11. The biochip of claim 10 , further comprising a pump.
12. The biochip of claim 11 , further comprising an embedded sensor.
13. The biochip of claim 12 , wherein the embedded sensor is an optical sensor.
14. A biochip comprising:
a transparent substrate;
a patterned passivating layer on the transparent substrate;
a patterned adhesion layer on the transparent substrate;
a second substrate bonded to the transparent substrate, the second substrate having a plurality of first landings, wherein the biochip comprises a microfluidic channel having the patterned adhesion layer as a sidewall, wherein the microfluidic channel comprises:
a first opening extending fully through the second substrate, the first opening being surrounded by a material of the second substrate;
a second opening extending fully through the second substrate, the second opening being different from the first opening and being surrounded by the material of the second substrate;
a connecting portion connecting the first opening and the second opening, wherein each opening into the connecting portion is surrounded by the material of the second substrate in a top down view, wherein the first landings overlie an exposed portion of the transparent substrate; and
second landings located on the second substrate.
15. The biochip of claim 14 , wherein the first landings have a first density and the second landings have a second density different from the first density.
16. The biochip of claim 15 , wherein the first landings and the second landings are different materials.
17. The biochip of claim 14 , further comprising a flow meter.
18. The biochip of claim 14 , further comprising a pressure transducer.
19. The biochip of claim 14 , further comprising a heater.
20. The biochip of claim 14 , further comprising a pump.