Electronic component
An electronic component includes a body portion and an external electrode. The external electrode is provided on a surface of the body portion. The external electrode includes a base electrode layer, a first Ni plated layer, and an upper plated layer. The first Ni plated layer is provided on the base electrode layer. The upper plated layer is provided above the first Ni plated layer. The first Ni plated layer includes Ni particles having an average particle size of not more than about 52 nm.
1. An electronic component comprising:
a body portion; and
an external electrode provided on a surface of the body portion; wherein
the external electrode including a base electrode layer, a first Ni plated layer provided on the base electrode layer, and an upper plated layer provided above the first Ni plated layer; and
the first Ni plated layer includes Ni particles having an average particle size of not more than about 52 nm.
2. The electronic component according to claim 1 , wherein
the external electrode further includes a second Ni plated layer between the first Ni plated layer and the upper plated layer; and
an average particle size of Ni particles included in the second Ni plated layer is not less than about 2.3 times the average particle size of the Ni particles included in the first Ni plated layer.
3. The electronic component according to claim 2 , wherein the first Ni plated layer has a thickness not less than about 0.03 times a thickness of the second Ni plated layer.
4. The electronic component according to claim 3 , wherein the first Ni plated layer has a thickness not more than about 14.5 times the thickness of the second Ni plated layer.
5. The electronic component according to claim 1 , wherein
the external electrode further includes a second Ni plated layer between the first Ni plated layer and the upper plated layer; and
the second Ni plated layer includes Ni particles having an average particle size of not less than about 99 nm.
6. The electronic component according to claim 5 , wherein the first Ni plated layer has a thickness not less than about 0.03 times a thickness of the second Ni plated layer.
7. The electronic component according to claim 6 , wherein the first Ni plated layer has a thickness not more than about 14.5 times the thickness of the second Ni plated layer.
8. The electronic component according to claim 1 , wherein the base electrode layer includes metal.
9. The electronic component according to claim 8 , wherein the base electrode layer further includes a metal oxide.
10. The electronic component according to claim 8 , wherein the base electrode layer further includes glass.
11. The electronic component according to claim 10 , wherein
the base electrode layer further includes a metal oxide.
12. The electronic component according to claim 8 , wherein the base electrode layer further includes a resin component.
13. The electronic component according to claim 12 , wherein the base electrode layer further includes a metal oxide.
14. The electronic component according to claim 8 , wherein the base electrode layer further includes glass and a resin component.
15. The electronic component according to claim 14 , wherein the base electrode layer further includes a metal oxide.
16. The electronic component according to claim 8 , wherein the metal includes Cu, Ag, Au, Ni, Sn, or an alloy including any of Cu, Ag, Au, Ni, and Sn.
17. The electronic component according to claim 1 , wherein the electronic component is a multilayer ceramic capacitor.
18. The electronic component according to claim 1 , wherein the body portion is a stacked body including a plurality of dielectric layers and a plurality of internal electrode layers that are alternately stacked on one another.
19. The electronic component according to claim 18 , wherein the plurality of internal electrode layers are connected to the external electrode.
20. The electronic component according to claim 18 , wherein each of the plurality of dielectric layers has a thickness of not less than about 0.4 μm and not more than about 0.6 μm.