IP Library › Granted Patent US 11,320,589
Granted Patent B1
US 11,320,589 · App. 17/084,186 · Granted May 3, 2022

Grating couplers integrated with one or more airgaps

Inventors: Yusheng Bian (Ballston Lake, NY); Siva P. Adusumilli (Burlington, VT); Bo Peng (Wappingers Falls, NY); Kenneth J. Giewont (Hopewell Junction, NY)
Assignee: GLOBALFOUNDRIES U.S. INC.
G02B6/124G02B6/13G02B2006/12061G02B2006/12107
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,320,589
App. No.
17/084,186
Granted
May 3, 2022
Kind
B1
Abstract

The present disclosure relates to semiconductor structures and, more particularly, to grating couplers integrated with one or more airgap and methods of manufacture. The structure includes: a substrate material comprising one or more airgaps; and a grating coupler disposed over the substrate material and the one or more airgaps.

Claims (24)

1. A structure comprising:

a substrate material comprising one or more airgaps; and

a grating coupler disposed over the substrate material and the one or more airgaps,

wherein the one or more airgaps comprises a plurality of airgaps with spaces comprising a non-periodic pitch under the grating coupler.

2. The structure of claim 1 , wherein the substrate material comprises bulk Si material.

3. The structure of claim 1 , wherein the grating coupler comprises a plurality of openings aligned with the one or more airgaps.

4. The structure of claim 1 , wherein the grating coupler comprises a plurality of openings offset from each of the one or more airgaps.

5. The structure of claim 1 , wherein epitaxial material seals the one or more airgaps and the substrate comprises Si.

6. The structure of claim 1 , wherein the grating coupler comprises polysilicon material patterned on a semiconductor material.

7. The structure of claim 1 , wherein the substrate material comprises a substrate of semiconductor-on-insulator (SOI) technology and the grating coupler comprises patterned semiconductor material of the SOI technology.

8. The structure of claim 1 , wherein the substrate material comprises a substrate of semiconductor-on-insulator (SOI) technology and the grating coupler comprises patterned polysilicon material on semiconductor material of the SOI technology.

9. The structure of claim 1 , wherein the one or more airgaps extend between trenches provided on opposing sides of the grating coupler.

10. A structure comprising:

a bulk substrate material comprising one or more sealed airgaps within the bulk substrate material;

a waveguide structure over the bulk substrate material; and

a grating coupler optically coupled to the waveguide structure and disposed over the one or more airgaps,

wherein spaces are provided between the one or more sealed airgaps at a constant pitch.

11. The structure of claim 10 , wherein the bulk substrate material comprises Si material and the waveguide structure and the grating coupler comprise a same semiconductor material.

12. The structure of claim 10 , wherein SiGe material seals the one or more sealed airgaps.

13. The structure of claim 10 , wherein the grating coupler comprises polysilicon material patterned on a semiconductor material and the waveguide structure comprises the semiconductor material.

14. The structure of claim 10 , wherein the bulk substrate material comprises a substrate of semiconductor on insulator (SOI) technology, the grating coupler comprises patterned semiconductor material of the SOI technology, and the one or more airgaps extend between trenches provided on opposing sides of the grating coupler.

15. A method comprising:

forming one or more sealed airgaps in a bulk substrate material; and

forming a grating coupler over the bulk substrate material and the one or more airgaps.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 29, 2020
From: BIAN, YUSHENG; ADUSUMILLI, SIVA P.; PENG, BO; GIEWONT, KENNETH J.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054215/0129 →
Cited By (2)
US 12,405,423 US 12,541,061