Techniques for an inductor at a first level interface
Techniques are provided for an inductor at a first level interface between a first die and a second die. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first die, second conductive traces of a second die, and a plurality of connectors configured to connect the first die with the second die. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.
1. An apparatus comprising:
a first die having first plurality of external terminations;
a second die having a second plurality of external terminations;
an interposer located between the first die and the second die, the interposer including a plurality of conductive vias;
a plurality of connectors coupling the first plurality of external terminations to the second plurality of external terminations;
an inductor winding comprising the plurality of connectors and the plurality of conductive vias; and
a layer of magnetic material disposed in a space between the second die and the interposer, within a number of solder balls between the second die and the interposer.
2. The apparatus of claim 1 , wherein an integrated circuit package includes the second die.
3. The apparatus of claim 1 , wherein the plurality of connectors includes solder balls.
4. The apparatus of claim 1 , wherein the plurality of connectors is arranged in two groups and the magnetic material is disposed between the two groups of connectors.
5. The apparatus of claim 1 , wherein the magnetic material is mechanically coupled to a surface of the second die, the surface directly adjacent the interposer.
6. The apparatus of claim 1 , wherein the magnetic material is mechanically coupled to a surface of the interposer, the surface directly adjacent the second die.