Light-emitting diode package and electronic device
Some embodiments of the present disclosure provide a light-emitting diode package. The light-emitting diode package includes a transparent substrate. The light-emitting diode package also includes a first light-emitting diode which is disposed on the transparent substrate and has a first multiple quantum well structure. The light-emitting diode package further includes a second light-emitting diode which is disposed on the transparent substrate and has a second multiple quantum well structure. The first multiple quantum well structure and the second multiple quantum well structure are disposed to emit lights with different wavelengths.
1. A light-emitting diode package, comprising:
a transparent substrate;
a first light-emitting diode disposed on the transparent substrate, wherein the first light-emitting diode has a first multiple quantum well structure; and
a second light-emitting diode disposed on the transparent substrate, wherein the second light-emitting diode has a second multiple quantum well structure,
wherein the first multiple quantum well structure and the second multiple quantum well structure are configured to emit lights with different wavelengths, wherein at least one of the first light-emitting diode and the second light-emitting diode sticks to the transparent substrate by using a transparent adhesive layer, and wherein a surface of the transparent substrate away from the first light-emitting diode and the second light-emitting diode has a rough surface.
2. The light-emitting diode package as claimed in claim 1 , wherein the transparent substrate is an epitaxial substrate for forming the first light-emitting diode.
3. The light-emitting diode package as claimed in claim 1 , further comprising:
a thickness adjustment layer disposed between the transparent substrate and the second light-emitting diode.
4. The light-emitting diode package as claimed in claim 1 , further comprising:
an epitaxial substrate used for forming the first light-emitting diode and disposed between the transparent substrate and the first light-emitting diode.
5. The light-emitting diode package as claimed in claim 4 , wherein the first multiple quantum well structure emits a blue light or a green light.
6. The light-emitting diode package as claimed in claim 5 , wherein the second multiple quantum well structure emits a red light.
7. The light-emitting diode package as claimed in claim 1 , further comprising:
an anti-reflection layer disposed on the transparent substrate.
8. The light-emitting diode package as claimed in claim 1 , further comprising:
an anti-reflection layer disposed between the transparent substrate and the first light-emitting diode and disposed between the transparent substrate and the second light-emitting diode.
9. The light-emitting diode package as claimed in claim 1 , wherein the transparent substrate comprises a plurality of openings and a plurality of conductive elements in the plurality of openings, respectively.
10. An electronic device, comprising:
a circuit substrate; and
a light-emitting diode package disposed on the circuit substrate and comprising:
a transparent substrate;
a first light-emitting diode disposed on the transparent substrate, wherein the first light-emitting diode has a first multiple quantum well structure; and
a second light-emitting diode disposed on the transparent substrate, wherein the second light-emitting diode has a second multiple quantum well structure,
wherein the first multiple quantum well structure and the second multiple quantum well structure are configured to emit lights with different wavelengths, wherein at least one of the first light-emitting diode and the second light-emitting diode sticks to the transparent substrate by using a transparent adhesive layer, and wherein a surface of the transparent substrate away from the first light-emitting diode and the second light-emitting diode has a rough surface.
11. The electronic device as claimed in claim 10 , wherein the transparent substrate is an epitaxial substrate for forming the first light-emitting diode.
12. The electronic device as claimed in claim 10 , further comprising:
a thickness adjustment layer disposed between the transparent substrate and the second light-emitting diode.
13. The electronic device as claimed in claim 10 , further comprising:
an epitaxial substrate used for forming the first light-emitting diode and disposed between the transparent substrate and the first light-emitting diode.
14. The electronic device as claimed in claim 13 , wherein the first multiple quantum well structure emits a blue light or a green light.
15. The electronic device as claimed in claim 14 , wherein the second multiple quantum well structure emits a red light.
16. The electronic device as claimed in claim 10 , further comprising:
an anti-reflection layer disposed on the transparent substrate.
17. The electronic device as claimed in claim 10 , further comprising:
an anti-reflection layer disposed between the transparent substrate and the first light-emitting diode and disposed between the transparent substrate and the second light-emitting diode.
18. The electronic device as claimed in claim 10 , wherein the transparent substrate comprises a plurality of openings and a plurality of conductive elements in the plurality of openings, respectively.