IP Library Granted Patent US 11,324,929
Granted Patent B2
US 11,324,929 · App. 15/654,450 · Granted May 10, 2022

Method of forming a guidewire assembly

Inventors: Nitin Patil (Albany, CA); Philip R. Houle (Sunnyvale, CA)
Assignee: PATHWAYS MEDICAL CORPORATION
A61M25/09A61B5/021A61B5/027A61B5/0215A61B5/1076A61B5/287A61B5/6851A61B2562/0247A61B2562/12A61M2025/0002A61M2025/09075A61M2025/09083A61M2025/09108
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Quick Facts
Patent No.
US 11,324,929
App. No.
15/654,450
Granted
May 10, 2022
Kind
B2
Abstract

Guidewires having conductive elements are described where in one variation, the guidewire may be formed by disposing an insulative layer upon a surface of the guidewire core, and printing one or more conductive traces directly upon a surface of the insulative layer.

Claims (14)

1. A method of forming a guidewire assembly, comprising:

providing a guidewire core;

disposing an insulative layer upon a surface of the guidewire core;

disposing a conductive layer upon a surface of the insulative layer;

removing portions of the conductive layer such that one or more conductive traces are formed upon the insulative layer; and

electrically connecting one or more pads on a flex circuit directly to one or more corresponding pads associated with the one or more conductive traces, wherein electrically connecting one or more pads on the flex circuit comprises electrically connecting the one or more pads to a first portion of an inner diameter of one or more ring elements and the one or more corresponding pads associated with the one or more conductive traces to a second portion of the inner diameter; and

securing a pressure sensor assembly along a portion of the guidewire core, wherein securing the pressure sensor assembly further comprises electrically connecting the flex circuit extending from the pressure sensor assembly to the one or more conductive traces.

2. A method of forming a guidewire assembly, comprising:

providing a guidewire core;

disposing an insulative layer upon a surface of the guidewire core;

disposing a conductive layer upon a surface of the insulative layer;

removing portions of the conductive layer such that one or more conductive traces are formed upon the insulative layer; and

securing a pressure sensor assembly along a portion of the guidewire core by electrically connecting one or more pads on a flex circuit extending from the pressure sensor assembly to a first portion of an inner diameter of one or more ring elements and one or more corresponding pads associated with the one or more conductive traces to a second portion of the inner diameter.

3. The method of claim 2 wherein securing the pressure sensor assembly further comprises electrically connecting the flex circuit extending from the pressure sensor assembly to the one or more conductive traces.

Assignments (5)
CHANGE OF ADDRESS Recorded Jan 19, 2022
From: PATHWAYS MEDICAL CORPORATION
To: PATHWAYS MEDICAL CORPORATION
Reel/Frame 058768/0491 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: CYGNUS INVESTMENT CORPORATION
To: PATHWAYS MEDICAL CORPORATION
Reel/Frame 053763/0777 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME AND ADDRESS PREVIOUSLY RECORDED AT REEL: 044958 FRAME: 0600. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 31, 2019
From: ANGIOMETRIX CORPORATION
To: CYGNUS INVESTMENT CORPORATION
Reel/Frame 049261/0467 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2017
From: PATIL, NITIN; HOULE, PHILIP R.
To: ANGIOMETRIX CORPORATION
Reel/Frame 044454/0315 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2017
From: ANGIOMETRIX CORPORATION
To: CYGNUS INVESTMENT CORPORATION, C/O SOLARIS CORPORATE SERVICES LTD.
Reel/Frame 044958/0600 →
Continuity (4)
Provisional Application 62363987 · Jul 19, 2016
Provisional Application 62363992 · Jul 19, 2016
Provisional Application 62419090 · Nov 8, 2016
Related Publication 20180093078A1 · Apr 5, 2018