Implementing electronic enclosure cooling containment for concurrent maintenance actions

1. A structure for implementing electronic enclosure cooling containment for concurrent maintenance actions with a top cover of an associated electronic enclosure removed comprising:

a moveable airflow baffle being attached to the associated electronic enclosure;

the moveable airflow baffle being moved to an open position over at least a partial length of a replaceable component for the concurrent maintenance actions, without being detached or removed from the associated electronic enclosure; and

during normal operations, the moveable airflow baffle hangs down over at least a partial length of the replaceable component, and is contacted by at least a portion of airflow flowing through the associated electronic enclosure wherein the airflow contacts only a bottom portion of the moveable airflow baffle.

2. The structure as recited in claim 1 , wherein the moveable airflow baffle maintains typical airflow in the associated electronic enclosure for a period of time after the top cover is removed.

3. The structure as recited in claim 1 , wherein the moveable airflow baffle being attached to the associated electronic enclosure includes the moveable airflow baffle attached to one of a chassis, a chassis bulkhead, and a system airflow baffle.

4. The structure as recited in claim 1 , wherein the moveable airflow baffle includes a selected one of a hinged attachment and a fixed attachment to the associated electronic enclosure.

5. The structure as recited in claim 1 , includes a free end of the moveable airflow baffle free floating during normal operations.

6. The structure as recited in claim 1 , includes a free end of the moveable airflow baffle held open when moved to the open position, and the free end of the moveable airflow baffle returning to its hanging position for the normal operations when the moveable airflow baffle is not held open.

7. The structure as recited in claim 1 , wherein the moveable airflow baffle prevents the top cover of the associated electronic enclosure from being installed in the open position.

8. The structure as recited in claim 1 , wherein the moveable airflow baffle includes a selected one of a plastic moveable airflow baffle, and rubber moveable airflow baffle.

9. The structure as recited in claim 1 , wherein the moveable airflow baffle is formed of a flexible material having sufficient rigidity and strength to prevent the top cover of the associated electronic enclosure from being installed when the moveable airflow baffle is in the open position.

10. The structure as recited in claim 1 , wherein the moveable airflow baffle includes a finger loop at a free end used to assist moving the moveable airflow baffle.

11. A method for implementing electronic enclosure cooling containment for concurrent maintenance actions with a top cover of an associated electronic enclosure removed comprising:

providing a moveable airflow baffle being attached to the associated electronic enclosure;

moving the moveable airflow baffle to an open position over at least a partial length of a replaceable component for the concurrent maintenance actions, without being detached or removed from the associated electronic enclosure; and

during normal operations, providing the moveable airflow baffle to hang down over at least a partial length of the replaceable component, such that the moveable airflow baffle is contacted by at least a portion of airflow flowing through the associated electronic enclosure wherein the airflow contacts only a bottom portion of the moveable airflow baffle, and wherein the movable airflow baffle is disposed downstream from a source of the airflow.

12. The method as recited in claim 11 , includes providing a finger loop at a free end used to move the moveable airflow baffle.

13. The method as recited in claim 11 , wherein providing the moveable airflow baffle includes providing a selected one of a hinged attachment and a fixed attachment to the associated electronic enclosure.

14. The method as recited in claim 11 , wherein providing the moveable airflow baffle includes preventing the top cover of the associated electronic enclosure from being installed with the moveable airflow baffle in the open position.

15. The method as recited in claim 11 , wherein providing the moveable airflow baffle includes providing a selected one of a plastic moveable airflow baffle, and rubber moveable airflow baffle.

16. The method as recited in claim 11 , wherein providing the moveable airflow baffle includes forming the moveable airflow baffle of a flexible material having sufficient rigidity and strength to prevent the top cover of the associated electronic enclosure from being installed when the moveable airflow baffle is in the open position.

17. The method as recited in claim 11 , wherein providing the moveable airflow baffle includes providing the moveable airflow baffle to maintain typical airflow in the electronic enclosure for a period of time after the top cover is removed.

18. The method as recited in claim 11 , wherein providing the moveable airflow baffle includes a free end of the moveable airflow baffle free floating during the normal operations.

19. The method as recited in claim 11 , wherein providing the moveable airflow baffle includes providing a free end of the moveable airflow baffle held open when moved to the open position.

20. The method as recited in claim 11 , wherein providing the moveable airflow baffle includes providing a free end of the moveable airflow baffle returning to its hanging position for the normal operations when the moveable airflow baffle is not held open.