Three-dimensional thermal management apparatuses for electronic devices
Some examples described herein provide for three-dimensional (3D) thermal management apparatuses for thermal energy dissipation of thermal energy generated by an electronic device. In an example, an apparatus includes a thermal management apparatus that includes a primary base, a passive two-phase flow thermal carrier, and fins. The thermal carrier has a carrier base and one or more sidewalls extending from the carrier base. The carrier base and the one or more sidewalls are a single integral piece. The primary base is attached to the thermal carrier. The carrier base has an exterior surface that at least a portion of which defines a die contact region. The thermal carrier has an internal volume aligned with the die contact region. A fluid is disposed in the internal volume. The fins are attached to and extend from the one or more sidewalls of the thermal carrier.
1. An apparatus comprising:
a thermal management apparatus comprising:
a primary base;
a passive two-phase flow thermal carrier having a carrier base and one or more sidewalls extending from the carrier base, the carrier base and the one or more sidewalls being a single integral piece, the primary base being attached to the passive two-phase flow thermal carrier, the carrier base disposed within an opening in the primary base and having an exterior surface that at least a portion of which defines a die contact region, the passive two-phase flow thermal carrier having an internal volume aligned with the die contact region, a fluid being disposed in the internal volume; and
fins attached to and extending from the one or more sidewalls of the passive two-phase flow thermal carrier.
2. The apparatus of claim 1 , wherein the carrier base has channels in the carrier base at the die contact region.
3. The apparatus of claim 1 , wherein each of the fins extends parallel to the die contact region.
4. The apparatus of claim 1 , wherein each of the fins extends parallel to others of the fins, each of the fins extending non-parallel to the die contact region.
5. The apparatus of claim 1 , wherein each of the fins is a planar fin.
6. The apparatus of claim 1 , wherein each of the fins is a corrugated fin.
7. The apparatus of claim 1 , wherein the thermal management apparatus further includes one or more L-shaped passive two-phase flow thermal carriers, each of the one or more L-shaped passive two-phase flow thermal carriers being attached to the primary base and extending through and attached to the fins.
8. The apparatus of claim 1 further comprising:
an electronic device comprising:
a die; and
a substrate, the die being attached to the substrate by external connectors, and
wherein the thermal management apparatus is disposed on the electronic device, a thermal interface material being disposed between and contacting the die contact region and the die.
9. The apparatus of claim 1 , wherein the die contact region is further defined by at least a portion of the primary base.
10. The apparatus of claim 1 , wherein the exterior surface of the carrier base is coplanar with a surface of the primary base.