Signal transceiver apparatus and base station

1. A signal transceiver apparatus, comprising:

a plug-in card comprising:

two waveguide boards comprising waveguide slots positioned on a side of each of the two waveguide boards;

a multi-layer circuit board disposed between the two waveguide boards, wherein the multi-layer circuit board comprises metal layers positioned on each of two sides of the multi-layer circuit board, wherein a position of the metal layers and a position of the waveguide slots match to form two waveguide channels, wherein the two waveguide channels are respectively located on two sides of the multi-layer circuit board, and wherein the waveguide slots are positioned on a side of the two waveguide boards that faces the multi-layer circuit board;

an antenna array mounted on each of the two waveguide boards, wherein the two waveguide channels are each coupled to the antenna array;

a first waveguide interface mounted on each of the two waveguide boards, wherein the two waveguide channels are each coupled to the first waveguide interface; and

a backplane comprising a second waveguide interface,

wherein a waveguide connection between the plug-in card and the backplane is implemented through an interconnection between the first waveguide interface and the second waveguide interface.

2. The signal transceiver apparatus of claim 1 , further comprising a punched hole disposed on the multi-layer circuit board, wherein the punched hole couples the two waveguide channels located on the two sides of the multi-layer circuit board.

3. The signal transceiver apparatus of claim 1 , further comprising a cross groove provided at the metal layer of the multi-layer circuit board, wherein the cross groove passes through the metal layer on the two sides of the multi-layer circuit board.

4. The signal transceiver apparatus of claim 1 , wherein the plug-in card further comprises a front-end circuit disposed on the multi-layer circuit board, and wherein the front-end circuit is coupled to the antenna array using the two waveguide channels and is configured to amplify a radio frequency signal received or transmitted by the antenna array.

5. The signal transceiver apparatus of claim 4 , wherein the front-end circuit comprises:

a low-noise amplifier (LNA) configured to perform low-noise amplification on the radio frequency signal received by the antenna array; and

a power amplifier (PA) configured to:

perform power amplification on the radio frequency signal; and

send the radio frequency signal on which power amplification is performed to the antenna array.

6. The signal transceiver apparatus of claim 4 , wherein the multi-layer circuit board further comprises a grounding plane, wherein the two waveguide boards are coupled to the grounding plane, and wherein the two waveguide boards are configured to shield the front-end circuit from an interference signal.

7. The signal transceiver apparatus of claim 4 , wherein the multi-layer circuit board further comprise:

a pad coupled to the front-end circuit;

a heat conduction via coupled to the pad,

wherein the pad is coupled to a first waveguide board of the two waveguide boards using the heat conduction via.

8. The signal transceiver apparatus of claim 4 , wherein the front-end circuit is coupled to the two waveguide channels using a waveguide conversion section.

9. The signal transceiver apparatus of claim 1 , wherein the antenna array comprises two antenna sub-arrays mounted between the two waveguide boards and corresponding to the two waveguide channels.

10. The signal transceiver apparatus of claim 9 , wherein a first antenna sub-array of the two antenna sub-arrays is coupled to a first waveguide channel of the two waveguide channels formed between a first waveguide board of the two waveguide boards and the multi-layer circuit board, and wherein a second antenna sub-array of the two antenna sub-array is coupled to a second waveguide channel of the two waveguide channels formed between a second waveguide board of the two waveguide boards and the multi-layer circuit board.

11. The signal transceiver apparatus of claim 1 , wherein the first waveguide interface comprises two groups of waveguide interfaces, wherein a first group of waveguide interfaces of the first waveguide interface is disposed between a first waveguide board of the two waveguide boards and the multi-layer circuit board, and wherein a second group of waveguide interfaces of the first waveguide interface is disposed between a second waveguide board of the two waveguide boards and the multi-layer circuit board.

12. The signal transceiver apparatus of claim 1 , wherein the first waveguide interface and the second waveguide interface form a rectangular waveguide.

13. The signal transceiver apparatus of claim 1 , wherein the first waveguide interface and the second waveguide interface form a double-ridge waveguide.

14. The signal transceiver apparatus of claim 1 , wherein the first waveguide interface and the second waveguide interface form a single-ridge waveguide.

15. The signal transceiver apparatus of claim 14 , wherein the backplane further comprises a waveguide choke groove disposed on a periphery of the second waveguide interface.

16. The signal transceiver apparatus of claim 1 , wherein the backplane further comprises:

a radio frequency circuit comprising a first end and a second end, wherein the second end is coupled to the plug-in card, and wherein the radio frequency circuit is configured to:

perform down-conversion domain processing on a radio frequency signal to obtain an analog intermediate frequency signal; or

perform up-conversion processing on the analog intermediate frequency signal to obtain the radio frequency signal; and

a digital intermediate frequency processor coupled to the first end of the radio frequency circuit and configured to:

convert the analog intermediate frequency signal into a digital intermediate frequency signal; or

convert the digital intermediate frequency signal into the analog intermediate frequency signal.

17. The signal transceiver apparatus of claim 1 , wherein the backplane further comprises:

a backplane multi-layer circuit board configured to allow a digital intermediate frequency processor and a radio frequency circuit to be disposed thereon;

a shielding cover disposed on a first surface of the backplane multi-layer circuit board and configured to perform interference signal shielding; and

a heat dissipation device disposed on a second surface of the backplane multi-layer circuit board, wherein the first surface and the second surface are opposite surfaces, and wherein the heat dissipation device is configured to dissipate heat of the backplane multi-layer circuit board.

18. A base station, comprising:

a signal transceiver apparatus comprising:

a plug-in card comprising:

two waveguide boards comprising waveguide slots positioned on a side of each of the two waveguide boards;

a multilayer circuit board disposed between the two waveguide boards, wherein the multi-layer circuit board comprises metal layers positioned on each of two sides of the multi-layer circuit board, wherein a position of the metal layers and a position of the waveguide slots match to form waveguide channels, wherein the two waveguide channels are respectively located on two sides of the multi-layer circuit board, and wherein the waveguide slots are positioned on a side of the two waveguide boards that face the multi-layer circuit board;

an antenna array mounted on each of the two waveguide boards, wherein the two waveguide channels are each coupled to the antenna array; and

a first waveguide interface mounted on each of the two waveguide boards, wherein the two waveguide channels are each coupled to the first waveguide interface; and

a backplane comprising a second waveguide interface,

wherein a waveguide connection between the plug-in card and the backplane is implemented through an interconnection between the first waveguide interface and the second waveguide interface.

19. The base station of claim 18 , wherein a punched hole is disposed on the multi-layer circuit board, and wherein the punched hole couples the two waveguide channels located on the two sides of the multi-layer circuit board.

20. The base station of claim 18 , wherein a cross groove provided at the metal layer of the multi-layer circuit board, and wherein the cross groove passes through the metal layer on the two sides of the multi-layer circuit board.