IP Library Granted Patent US 11,330,360
Granted Patent B2
US 11,330,360 · App. 17/168,482 · Granted May 10, 2022

Headphone

Inventor: Yu Tsuchihashi (Hamamatsu, JP)
Assignee: Yamaha Corporation
H04R1/1083G10K11/172H04R1/1008H04R1/1041H04R1/2811
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Quick Facts
Patent No.
US 11,330,360
App. No.
17/168,482
Granted
May 10, 2022
Kind
B2
Abstract

A headphone includes an electro-acoustic transducer, a housing, a noise cancelling circuit, a resonant frequency converter, and a switch. The electro-acoustic transducer is configured to reproduce sound from electrical signals. The housing is attached to the electro-acoustic transducer. The noise cancelling circuit is configured to attenuate a noise sound by adding an antiphase sound to the noise sound. The resonant frequency converter is configured to change a resonant frequency of a Helmholtz resonator configured to include a cavity in the housing and a tubular cavity communicating with the cavity. The switch is configured to perform alteration of the resonant frequency and switching of the noise cancelling circuit, in conjunction with each other.

Claims (25)

1. A headphone comprising:

an electro-acoustic transducer configured to reproduce sound from electrical signals;

a housing to which the electro-acoustic transducer is attached;

a noise cancelling circuit configured to attenuate a noise sound by adding an antiphase sound to the noise sound;

a resonant frequency converter configured to change a resonant frequency of a Helmholtz resonator configured to include a cavity in the housing and a tubular cavity communicating with the cavity; and

a switch configured to perform alteration of the resonant frequency and switching of the noise cancelling circuit, in conjunction with each other.

2. The headphone of claim 1 wherein the resonant frequency converter is configured to change any one of a cross-sectional area of the tubular cavity, a length of the tubular cavity, and a volume of the cavity.

3. The headphone of claim 1 wherein the resonant frequency is higher when the noise cancelling circuit is turned on than when the noise cancelling circuit is turned off.

4. The headphone of claim 1 wherein the resonant frequency is lower when the noise cancelling circuit is turned off than when the noise cancelling circuit is turned on.

5. The headphone according to claim 1 , wherein

the housing includes an outer case and an inner case that partitions an inner space of the outer case into a front space having the electro-acoustic transducer and a rear space,

the inner case has a through-hole penetrating between the front space and the rear space, and

the through-hole is at least part of the tubular cavity of the Helmholtz resonator.

6. The headphone of claim 5 , further comprising an adapter having an auxiliary through-hole, wherein

the switch is adapted to switch a position of the adapter between a first position and a second position,

at the first position, the adapter is disposed so that the auxiliary through-hole avoids communication with the through-hole to form an entirety of the tubular cavity from the through-hole, and

at the second position, the adapter is disposed so that the auxiliary through-hole communicates with the through-hole to form the tubular cavity from the through-hole and the auxiliary through-hole.

7. The headphone of claim 6 , wherein the Helmholtz resonator includes:

a first Helmholtz resonator in which the cavity is in the front space; and

a second Helmholtz resonator in which the cavity is in the rear space.

8. The headphone of claim 5 , further comprising an adapter having a depressed surface, wherein

the switch is configured to switch a position of the adapter between a first position and a second position,

at the first position, the adapter is disposed so that a portion around a depressed surface is in close contact with an inner surface of the housing, to exclude a space sealed with the depressed surface and the housing from the cavity, and

at the second position, the adapter is disposed so that a portion around the depressed surface is away from the inner surface of the housing.

9. The headphone of claim 8 , wherein the cavity of the Helmholtz resonator is in one of the front space and the rear space, where the adapter is located.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2021
From: TSUCHIHASHI, YU
To: YAMAHA CORPORATION
Reel/Frame 055165/0533 →
Priority Claims (1)
JP JP2020-029167 · Feb 25, 2020 · national
Continuity (1)
Related Publication 20210266656A1 · Aug 26, 2021