Electronic component assembly and method for manufacturing the same

1. An electronic component assembly comprising:

an electronic component including:

a stacked body including a plurality of stacked ceramic layers, the stacked body including:

a first main surface and a second main surface opposite to each other in a stacking direction;

a first lateral surface and a second lateral surface opposite to each other in a width direction orthogonal or substantially orthogonal to the stacking direction; and

a first end surface and a second end surface opposite to each other in a length direction orthogonal or substantially orthogonal to the stacking direction and the width direction;

a first external electrode covering the first end surface, and extending from the first end surface to cover a portion of each of the first main surface, the second main surface, the first lateral surface, and the second lateral surface;

a second external electrode covering the second end surface, and extending from the second end surface to cover a portion of each of the first main surface, the second main surface, the first lateral surface, and the second lateral surface; and

an insulating layer covering the first main surface of the stacked body, a portion of the first external electrode exposed at the first main surface, and a portion of the second external electrode exposed at the first main surface; and

a mounting board including:

a board main body including a mounting surface; and

a land electrode on the mounting surface; wherein

the first main surface of the electronic component faces the mounting surface of the mounting board;

the first external electrode and the second external electrode are mounted on the land electrode with solder;

in a cross section taken at a center or approximate center in the width direction, the insulating layer has a filling ratio of about 90% or more; and

both end portions of the insulating layer in the length direction are located on an outer side relative to the first and second end surfaces of the stacked body at least in the cross section taken at the center or the approximate center in the width direction.

2. The electronic component assembly according to claim 1 , wherein the insulating layer entirely covers the first main surface of the electronic component.

3. The electronic component assembly according to claim 1 , wherein the insulating layer is not provided on the first lateral surface and the second lateral surface of the electronic component.

4. The electronic component assembly according to claim 1 , wherein the insulating layer is made of a ceramic.

5. The electronic component assembly according to claim 4 , wherein the ceramic included in the insulating layer is smaller in grain size than ceramic included in the ceramic layers of the stacked body.

6. The electronic component assembly according to claim 4 , wherein the ceramic included in the insulating layer is at least one of Al 2 O 3 , PZT, SiC, SiO 2 , and MgO.

7. The electronic component assembly according to claim 1 , wherein the insulating layer has a thickness of about 5.0 μm or less.

8. The electronic component assembly according to claim 1 , wherein the insulating layer covers the second main surface of the stacked body, a portion of the first external electrode exposed at the second main surface, and a portion of the second external electrode exposed at the second main surface.

9. The electronic component assembly according to claim 1 , wherein the electronic component assembly includes a space where the insulating layer and the solder are not in contact with each other, the space being defined by the insulating layer and the land electrode.

10. The electronic component assembly according to claim 1 , wherein the electronic component satisfies the condition of t 0 /T≤about 0.1, where T is a dimension of electronic component in the stacking direction, and t 0 is a dimension of insulating layer in the stacking direction at an end surface of the insulating layer.

11. The electronic component assembly according to claim 1 , wherein each of the plurality of stacked ceramic layers is at least one of a piezoelectric ceramic, a semiconductor ceramic, and a magnetic ceramic.

12. The electronic component assembly according to claim 1 , wherein the insulating layer includes a resin.

13. The electronic component assembly according to claim 12 , wherein the resin included in the insulating layer is at least one of epoxy resin, silicone resin, fluorine resin, phenolic resin, urea resin, melamine resin, unsaturated polyester resin, barium titanate, alumina, silica, yttria, and zirconia.

14. The electronic component assembly according to claim 1 , wherein the stacked body further includes a plurality of internal electrode layers provided on the plurality of stacked ceramic layers.

15. The electronic component assembly according to claim 1 , wherein

the plurality of internal electrode layers includes a plurality of first internal electrode layers that are electrically connected to the first external electrode; and

the plurality of internal electrode layers includes a plurality of second internal electrode layers that are electrically connected to the second external electrode.