IP Library › Granted Patent US 1,134,331
Granted Patent S1
US 1,134,331 · App. 35/524,417 · Granted Jul 14, 2026

CPU module

Inventors: Kazuhira Urushizaki (Musashino, JP); Tatsuya Kurihara (Musashino, JP); Liang Ma (Musashino, JP); Keiichi Sasaki (Musashino, JP); Atsushi Tsuruta (Musashino, JP); Yoshiya Watanabe (Tokyo, JP); Jumpei Okamoto (Tokyo, JP)
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Quick Facts
Patent No.
US 1,134,331
App. No.
35/524,417
Granted
Jul 14, 2026
Kind
S1
Claims (1)

The ornamental design for a CPU module as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2026
From: URUSHIZAKI, KAZUHIRA; KURIHARA, TATSUYA; MA, LIANG; SASAKI, KEIICHI; TSURUTA, ATSUSHI; WATANABE, YOSHIYA; OKAMOTO, JUMPEI
To: YOKOGAWA ELECTRIC CORPORATION
Reel/Frame 074512/0967 →
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