Resin composition, and resin film, metal foil with resin, metal clad laminate, wiring board, and circuit mount component using same
One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).
1. A resin composition containing
a polyrotaxane (A),
an epoxy resin (B), and
a curing agent (C),
wherein the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.5 parts by mass or more and 9.5 parts by mass or less based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).
2. The resin composition according to claim 1 , wherein
the curing agent (C) contains an isocyanate compound (C-2), and
a content of the isocyanate compound (C-2) is less than 45 parts by mass based on 100 parts by mass of the polyrotaxane (A).
3. The resin composition according to claim 1 , wherein the curing agent (C) contains 30% by mass or more of a monofunctional acid anhydride.
4. The resin composition according to claim 3 , wherein a molar ratio of the monofunctional acid anhydride to a hydroxyl group derived from the polyrotaxane (A) is in a range of 0.01 to 0.8.
5. The resin composition according to claim 3 , wherein a molar ratio of the monofunctional acid anhydride to an epoxy group of the epoxy resin (B) is in a range of 0.01 to 1.1.
6. The resin composition according to claim 3 , wherein the monofunctional acid anhydride is an alicyclic compound.
7. The resin composition according to claim 1 , containing
40 to 89.9 parts by mass of the polyrotaxane (A),
10 to 59.9 parts by mass of the epoxy resin (B), and
0.1 parts by mass to 10 parts by mass or less of the curing agent (C),
based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).
8. The resin composition according to claim 1 , further containing a color material (D).
9. A resin film comprising a resin layer containing a dried or partially-cured product of the resin composition according to claim 1 , and a film-supporting base material.
10. A metal foil with resin, comprising a resin layer containing a dried or partially-cured product of the resin composition according to claim 1 , and a metal foil.
11. A metal clad laminate comprising an insulating layer containing a cured product of the resin composition according to claim 1 , and a metal foil.
12. A wiring board having an insulating layer containing a cured product of the resin composition according to claim 1 , and conductor wiring.
13. A circuit mount component in which an electronic component is mounted on the wiring board according to claim 12 .