Radiofrequency device with adjustable LC circuit comprising an electrical and/or electronic module
Radiofrequency device with adjustable LC circuit comprising an electrical and/or electronic module. The invention relates to a communication device with a radio-frequency chip, said device comprising—an insulating support layer, —an electrical and/or electronic radiofrequency circuit on said insulating layer, said circuit comprising plates of an adjustable capacitor and/or an antenna spiral with adjustable inductance, —at least one element for adjusting a tuning frequency of the radiofrequency circuit. The device is distinguished in that said plates and/or spiral are included in an electrical and/or electronic chip card module, and in that said adjusting element connects an intermediate point of the spiral so as to decrease the available inductance and/or splits or links the plates so as to adjust the capacitance.
1. Radiofrequency communication device, wherein said device comprises
an insulating support layer,
an electrical and/or electronic radiofrequency circuit comprising conductive plates of an adjustable capacitor and an antenna helix, said helix and at least one first plate of said conductive plates extending on a first face of said support layer, at least two second plates of said conductive plates connected electrically by at least one electrical connection and arranged on a second face of said support layer so as to oppose said at least one first plate, and
at least one element for adjusting a tuning frequency of the radiofrequency circuit, wherein said adjustment element splits or connects the conductive plates to adjust the capacitance,
wherein said at least two second plates are connected electrically by at least one electrical connection formed of non-switching conductive material, and
wherein said conductive plates and/or said helix are directly supported on said insulating support layer to define an electrical and/or electronic module of a chip card type.
2. Device according to claim 1 , wherein the module has a main face having an area less than or equal to 375 mm 2 .
3. Device according to claim 1 , wherein said adjustment element's adjustment equals or compensates for a variation in internal capacitance of the radiofrequency circuit greater than 5 μF.
4. Device according to claim 1 , comprising a support body incorporating or interacting with said module, wherein the support body bears an electrical element of the electrical and/or electronic circuit, and wherein said electrical element is configured to connect or interact with the module.
5. Device according to claim 4 , wherein said electrical element is selected from among a radiofrequency chip, a second antenna, a relay antenna and a second capacitance configured to connect or interact with said electrical circuit.
6. Device according to claim 1 , wherein said at least one electrical connection between said two second conductive plates is a bonded wire.
7. Device according to claim 1 , wherein said at least one electrical connection between said two second conductive plates is a conductive printing or an electrically conductive deposit.
8. Device according to claim 1 , wherein said at least one electrical connection is pre-wired by metallization of the insulating support layer and has a cutting mark.
9. Device according to claim 1 , wherein the antenna helix is formed on the module, comprises several turns and features connection ends or terminals emerging on a face of the module.
10. Device according to claim 1 , wherein the antenna helix is formed outside the module and wherein the module comprises interconnection pads emerging on a face of the module, wherein said pads are configured to connect antenna connection ends or terminals.
11. Device according to claim 1 forming a chip card or a passport and comprising a passive antenna coupled electromagnetically to the antenna helix formed on the module.
12. Device according to claim 1 , wherein a further adjustment element connects an intermediate point of the helix to reduce the available inductance.
13. Method for manufacturing a radiofrequency communication device with a chip, wherein said device comprises:
an insulating support layer,
an electrical and/or electronic radiofrequency circuit on comprising conductive plates of an adjustable capacitor and an antenna helix, said helix and at least one first plate of said conductive plates extending on a first face of said support layer, at least two second plates of said conductive plates connected electrically by at least one electrical connection and arranged on a second face of said support layer so as to oppose said at least one first plate, and
at least one element for adjusting a tuning frequency of the radiofrequency circuit, wherein said adjustment element is configured so as to split or connect the conductive plates to adjust the capacitance,
wherein said at least two second plates are connected electrically by at least one electrical connection formed of non-switching conductive material, and
wherein said conductive plates and/or said helix are directly supported on said insulating support layer to define an electrical and/or electronic module of a chip card type.