Recording head with focusing structure

1. A method, comprising:

forming a patterned first hard mask comprising a plurality of layers;

removing at least one layer of the first hard mask to expose a layer of tantalum nitride having first and second portions on opposing sides of a patterned line structure, wherein the line structure has a first end having a first width and a second end having a second width, smaller than the first width, and the second width is consistent along at least a third of the length of the line structure;

forming a second hard mask on the exposed layer, wherein the second hard mask is patterned to include an opening over the first and second portions adjacent the line structure and a parabolic-shaped extension into the opening overlapping the second end of the line structure;

removing the second hard mask and regions of the first and second portions exposed through the opening in the second hard mask;

depositing optically reflective material in the regions of the first and second portions to form first and second reflectors of a subwavelength-sized focusing mirror, each of the first and second reflectors having a curved edge coupled to a straight edge, wherein the straight edges are spaced apart from each other by a distance of the second width.

2. The method of claim 1 , further comprising:

forming a media-facing surface substantially perpendicular to the straight edges of the first and second reflectors; and

lapping the media-facing surface to provide a distance, D, measured along an axis normal to the media-facing surface between the media-facing surface and the point where the curved edges of the first and second reflectors meet the straight edges.

3. The method of claim 2 , wherein D is between about 10 nm and about 60 nm.

4. The method of claim 2 , wherein D is between about 20 nm and about 50 nm.

5. The method of claim 2 , wherein D is between about 15 nm and about 40 nm.

6. The method of claim 1 , wherein forming the patterned first hard mask comprises:

forming a first amorphous carbon layer;

forming a chromium layer on the first amorphous carbon layer;

forming a second amorphous carbon layer on the chromium layer, wherein the second amorphous carbon layer has a thickness at least ten times greater than a thickness of the first amorphous carbon layer;

forming a tantalum nitride layer on the second amorphous carbon layer;

forming a third amorphous carbon layer on the tantalum nitride layer, wherein the third amorphous carbon layer has a thickness less than a thickness of the first amorphous carbon layer; and

forming a silicon dioxide layer on the third amorphous carbon layer.

7. The method of claim 6 , wherein removing at least one top layer of the first hard mask comprises removing the silicon dioxide layer and the third amorphous carbon layer.

8. The method of claim 1 , wherein the second width is between about 150 nm and about 500 nm.

9. The method of claim 1 , wherein the second width is about 200 nm.

10. The method of claim 1 , wherein the optically reflective material comprises at least one of Au, Ag, Rh, and Cu.

11. The method of claim 1 , wherein the optically reflective material comprises Au.

12. The method of claim 1 , further comprising patterning a near-field transducer prior to forming the patterned first hard mask.

13. The method of claim 12 , wherein the first and second reflectors are disposed on cross track sides of the near-field transducer.

14. The method of claim 1 , wherein removing the second hard mask and regions of the first and second portions exposed through the opening in the second hard mask comprises inductively coupled plasma etching.