IP Library Granted Patent US 11,385,259
Granted Patent B2
US 11,385,259 · App. 16/627,209 · Granted Jul 12, 2022

Probe member for pogo pin, method of manufacturing the probe member, pogo pin comprising the probe member

Inventor: Young Bae Chung (Seongnam-si, KR)
Assignee: ISC CO., LTD.
G01R1/06722G01R1/06755G01R3/00
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Quick Facts
Patent No.
US 11,385,259
App. No.
16/627,209
Granted
Jul 12, 2022
Kind
B2
Abstract

A probe member for a pogo pin, a method of manufacturing the probe member, and a pogo pin including the probe member are disclosed. The probe member for the pogo pin has a contact portion including a material having hardness greater than the hardness of a first body portion and a second body portion, and each of the first and second body portions includes a material having electrical conductivity equal to or greater than 50% IACS (International Annealed Copper Standard).

Claims (20)

1. A probe member for a pogo pin used in a test socket, the probe member having an axial length and a width extending transverse thereto and being configured to be at least partially inserted in a pipe having an internal space, the probe member comprising:

at least two contact portions each having a pointed tip on one end and configured to be brought into contact with a terminal of a test-target object;

a first body portion having a polygonal or circular pillar shape, the other end of each of the at least two contact portions being coupled to one end of the first body portion; and

a second body portion having a polygonal or circular pillar shape, the other end of the first body portion being coupled to one end of the second body portion,

wherein the at least two contact portions comprise a material having higher hardness than the first and second body portions, the material of the at least two contact portions being disposed across the entirety of the respective widths thereof, and each of the first and second body portions comprises a material having electrical conductivity equal to or greater than 50% IACS (International Annealed Copper Standard), the material of each of the first and second body portions being disposed across the entirety of the respective widths thereof,

wherein the at least two contact portions are spaced apart from each other.

2. The probe member of claim 1 , wherein the at least two contact portions comprise nickel or a nickel alloy.

3. The probe member of claim 1 , wherein the first body portion or the second body portion comprises a material containing at least one element selected from the group consisting of copper (Cu), gold (Au), silver (Ag), carbon (C), palladium (Pd), ruthenium (Ru), tungsten (W), aluminum (Al), tin (Sn), and rhodium (Rh).

4. The probe member of claim 2 , wherein the at least two contact portions comprise nickel alloy, and the nickel alloy comprises nickel (Ni) and at least one alloying element selected from the group consisting of carbon (C), boron (B), tungsten (W), manganese (Mn), titanium (Ti), palladium (Pd), oxygen (O), cobalt (Co), silver (Ag), indium (In), gallium (Ga), and a rare earth element.

5. The probe member of claim 4 , wherein the at least two contact portions comprise nickel alloy, and the nickel alloy comprises 0.1 to 50 parts by weight of the at least one alloying element based on 100 parts by weight of the nickel alloy.

6. The probe member of claim 1 , wherein the at least two contact portions have a hardness of about 700 Hv (Vickers hardness) or greater, and each of the first and second body portions has a hardness of about 50 Hv to about 700 Hv.

7. The probe member of claim 1 , wherein the first and second body portions are alternately stacked.

8. The probe member of claim 1 , wherein the at least two contact portions each have a quadrangular pyramid shape and lateral surfaces of the quadrangular pyramid shape have an equilateral triangle shape with an apex angle of 50° to 90°.

9. The probe member of claim 1 , wherein the at least two contact portions each have a height of about 650 μm or less.

10. The probe member of claim 1 , wherein a distance between adjacent contact portions of the at least two contact portions is about 15 μm or greater.

11. A pogo pin configured to be brought into contact with a terminal of a semiconductor device for inspecting electrical characteristics of the semiconductor device, the pogo pin comprising:

the probe member of claim 1 ;

a pipe including an internal space to receive a portion of the probe member;

a plunger having a portion inserted in the internal space and another portion protruding outward from the pipe; and

an elastic member having one end coupled to the probe member to bias the probe member toward an outside of the pipe, and the other end coupled to the plunger.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 27, 2019
From: CHUNG, YOUNG BAE
To: ISC CO., LTD.
Reel/Frame 051380/0515 →
Priority Claims (1)
KR 10-2017-0081746 · Jun 28, 2017 · national
Continuity (1)
Related Publication 20200124637A1 · Apr 23, 2020