Memory stacks and methods of forming the same
Memory stacks and method of forming the same are provided. A memory stack includes a bottom electrode layer, a top electrode layer and a phase change layer between the bottom electrode layer and the top electrode layer. A width of the top electrode layer is greater than a width of the phase change layer. A first portion of the top electrode layer uncovered by the phase change layer is rougher than a second portion of the top electrode layer covered by the phase change layer.
1. A memory stack, comprising:
a bottom electrode layer, a top electrode layer and a phase change layer between the bottom electrode layer and the top electrode layer,
wherein a width of the top electrode layer is greater than a width of the phase change layer, and a first portion of the top electrode layer uncovered by the phase change layer is rougher than a second portion of the top electrode layer covered by the phase change layer.
2. The memory stack of claim 1 , further comprising a polymer layer disposed on a sidewall of the phase change layer.
3. The memory stack of claim 1 , wherein a width of the phase change layer is greater than a width of the bottom electrode layer.
4. The memory stack of claim 1 , wherein a width of the phase change layer is less than a width of the bottom electrode layer.
5. The memory stack of claim 1 , wherein the first portion of the top electrode layer uncovered by the phase change layer has a roughness Rz of 0.5 nm to 1.5 nm.
6. The memory stack of claim 1 , wherein a sidewall of the phase change layer has a roughness Rz of 0.5 nm to 1.5 nm.
7. The memory stack of claim 1 , wherein at least one void is aside the phase change layer and between the bottom electrode layer and the top electrode layer.
8. The memory stack of claim 1 , further comprising:
a dielectric layer aside the phase change layer; and
a moisture-resistant layer between the phase change layer and the dielectric layer.
9. The memory stack of claim 1 , wherein the phase change layer has a narrow-middle profile that is narrow in a middle portion thereof.
10. A memory stack, comprising:
a bottom electrode layer;
a first dielectric layer aside the bottom electrode layer;
a phase change layer over the bottom electrode layer;
a second dielectric layer aside the phase change layer; and
a top electrode layer over the phase change layer,
wherein at least one void is enclosed by the top electrode layer, the phase change layer, the second dielectric layer and the bottom electrode layer, and
wherein a polymer layer is disposed laterally along a bottom surface of the top electrode layer and extends downwardly along a sidewall of the phase change layer.
11. The memory stack of claim 10 , wherein the polymer layer further extends laterally along a top surface of the bottom electrode layer.
12. The memory stack of claim 10 , further comprising a moisture-resistant layer disposed between the at least one void and the second dielectric layer.
13. The memory stack of claim 12 , wherein the moisture-resistant layer is further disposed on a sidewall of the top electrode layer.
14. The memory stack of claim 10 , wherein the second dielectric layer is further extends below the top electrode layer.
15. The memory stack of claim 10 , wherein a width of the top electrode layer is greater than a width of the phase change layer.
16. The memory stack of claim 10 , wherein the phase change layer has a narrow-middle profile that is narrow in a middle portion thereof.
17. A memory stack, comprising:
a bottom electrode layer;
a phase change layer over the bottom electrode layer;
a top electrode layer over the phase change layer;
a moisture-resistant layer laterally surrounding the top electrode layer and the phase change layer, wherein the moisture-resistant layer is in contact with the top electrode layer but separated from the phase change layer and the bottom electrode layer,
wherein a bottom surface of the moisture-resistant layer is flushed with a bottom surface of the phase change layer.
18. The memory stack of claim 17 , wherein at least one void is between the phase change layer and the moisture-resistant layer.
19. The memory stack of claim 17 , further comprising a dielectric layer laterally surrounding the moisture-resistant layer, wherein the dielectric layer and the moisture-resistant layer comprise different materials.
20. The memory stack of claim 17 , further comprising a polymer layer between the phase change layer and the moisture-resistant layer, wherein the polymer layer is in contact with the phase change layer but separated from the moisture-resistant layer.