Machine and method of resisting debris accumulation on milling enclosure of machine
A rotary mixer includes a frame. The rotary mixer also includes a milling enclosure supported by the frame. The milling enclosure includes a side plate. The rotary mixer further includes a rotor disposed within the milling enclosure. The rotary mixer includes at least one vibration device coupled to the milling enclosure. The at least one vibration device is arranged to induce vibrations in at least one component of the milling enclosure for resisting accumulation of debris on the at least one component.
1. A rotary mixer comprising:
a frame;
a milling enclosure supported by the frame, the milling enclosure including a side plate;
a rotor disposed within the milling enclosure;
at least one vibration device coupled to the milling enclosure, wherein the at least one vibration device is arranged to induce vibrations in at least one component of the milling enclosure for resisting accumulation of debris on the at least one component;
a controller configured to control one or more operating parameters of the at least one vibration device; and
a sensor communicably coupled to the controller, wherein the controller is configured to control the at least one vibration device based on an input signal received from the sensor, wherein the at least one vibration device includes the sensor, wherein the sensor is configured to generate the input signal indicative of a relative distance between the at least one vibration device and the milling enclosure.
2. The rotary mixer of claim 1 , wherein the side plate includes a movable side plate and the at least one vibration device is coupled to the side plate of the milling enclosure.
3. The rotary mixer of claim 1 , wherein the one or more operating parameters include at least one of an activation of the at least one vibration device, a direction of vibration forces, an amplitude of vibrations, and a frequency of vibrations.
4. A milling machine comprising:
a frame;
a milling enclosure supported by the frame, the milling enclosure including a side plate;
a rotor disposed within the milling enclosure;
at least one vibration device coupled to the milling enclosure, wherein the at least one vibration device is arranged to induce vibrations in at least one component of the milling enclosure for resisting accumulation of debris on the at least one component;
a controller configured to control one or more operating parameters of the at least one vibration device; and
a sensor communicably coupled to the controller, wherein the controller is configured to control the at least one vibration device based on an input signal received from the sensor, wherein the at least one vibration device includes the sensor, wherein the sensor is configured to generate the input signal indicative of a relative distance between the at least one vibration device and the milling enclosure.
5. The milling machine of claim 4 , wherein the side plate includes a movable side plate and the at least one vibration device is coupled to the side plate of the milling enclosure.
6. The milling machine of claim 4 , wherein the one or more operating parameters include at least one of an activation of the at least one vibration device, a direction of vibration forces, an amplitude of vibrations, and a frequency of vibrations.
7. A method of resisting debris accumulation on a milling enclosure of a machine, the method comprising:
coupling at least one vibration device to the milling enclosure;
activating the at least one vibration device to induce vibrations in at least one component of the milling enclosure for resisting accumulation of debris on the at least one component
controlling, by a controller, one or more operating parameters of the at least one vibration device;
controlling, by the controller, the at least one vibration device based on an input signal received from a sensor, wherein the sensor is communicably coupled to the controller; and
generating, by the sensor, the input signal indicative of a relative distance between the at least one vibration device and the milling enclosure.
8. The method of claim 7 further comprising coupling the at least one vibration device to a movable side plate of the milling enclosure.
9. The method of claim 7 , wherein the one or more operating parameters include at least one of an activation of the at least one vibration device, a direction of vibration forces, an amplitude of vibrations, and a frequency of vibrations.