IP Library Granted Patent US 11,444,072
Granted Patent B2
US 11,444,072 · App. 16/932,394 · Granted Sep 13, 2022

Dual-port SRAM structure

Inventor: Jhon Jhy Liaw (Hsinchu County, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
H01L27/0207H01L27/0924H01L27/1104
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,444,072
App. No.
16/932,394
Granted
Sep 13, 2022
Kind
B2
Abstract

The static random access memory (SRAM) cell of the present disclosure includes a first pull-down device, a second pull-down device, a first pass-gate device, and a second pass-gate device in a first p-well on a substrate; a third pull-down device, a fourth pull-down device, a third pass-gate device, and a fourth pass-gate device in a second p-well on the substrate; a first pull-up device and a second pull-up device in an n-well between the first p-well and the second p-well; and a first landing pad between the second pull-down device and the first pull-up device. The first landing pad is electrically coupled to a gate structure of the second pass-gate device by way of a first gate via.

Claims (46)

1. A static random access memory (SRAM) cell comprising:

a first pull-down device (PD-1), a second pull-down device (PD-2), a first pass-gate device (PG-1), and a second pass-gate device (PG-2) disposed in a first p-well on a substrate, wherein active regions of the second pass-gate device (PG-2) and the second pull-down device (PD-2) are aligned along a first direction;

a third pull-down device (PD-3), a fourth pull-down device (PD-4), a third pass-gate device (PG-3), and a fourth pass-gate device (PG-4) disposed in a second p-well on the substrate, wherein active regions of the third pass-gate device (PG-3) and the third pull-down device (PD-3) are aligned along the first direction;

a first pull-up device (PU-1) and a second pull-up device (PU-2) disposed in an n-well disposed between the first p-well and the second p-well, where an active region of the first pull-up device (PU-1) extends along the first direction; and

a first landing pad disposed between the second pull-down device (PD-2) and the first pull-up device (PU-1), wherein the first landing pad is electrically coupled to a gate structure of the second pass-gate device (PG-2) by way of a first gate via.

2. The SRAM cell of claim 1 , wherein the first gate via is disposed between the second pull-down device (PD-2) and the first pull-up device (PU-1).

3. The SRAM cell of claim 1 , further comprising:

a second landing pad disposed between the third pull-down device (PD-3) and the second pull-up device (PU-2), wherein the second landing pad is electrically coupled to a gate structure of a third pass-gate device (PG-3) by way of a second gate via.

4. The SRAM cell of claim 3 , wherein the second gate via is disposed between the third pull-down device (PD-3) and the second pull-up device (PU-2).

5. The SRAM cell of claim 1 , wherein a drain of the first pull-down device (PD-1), a drain of the second pull-down device (PD-2), and a drain the first pull-up device (PU-1) are electrically coupled to a first long contact.

6. The SRAM cell of claim 1 , wherein a drain of the third pull-down device (PD-3), a drain of the fourth pull-down device (PD-4), and a drain the second pull-up device (PU-2) are electrically coupled to a first long contact.

7. The SRAM cell of claim 1 , wherein a source of the first pull-down device (PD-1) and a source of the second pull-down device (PD-2) are electrically coupled to a third long contact.

8. The SRAM cell of claim 1 , wherein a source of the third pull-down device (PD-3) and a source of the fourth pull-down device (PD-4) are electrically coupled to a third long contact.

9. A static random access memory (SRAM) cell comprising:

a first pull-down device (PD-1), a second pull-down device (PD-2), a first pass-gate device (PG-1), and a second pass-gate device (PG-2) disposed in a first p-well on a substrate;

a third pull-down device (PD-3), a fourth pull-down device (PD-4), a third pass-gate device (PG-3), and a fourth pass-gate device (PG-4) disposed in a second p-well on the substrate; and

a first pull-up device (PU-1) and a second pull-up device (PU-2) disposed in an n-well disposed between the first p-well and the second p-well,

wherein the first pull-down device (PD-1), the second pull-down device (PD-2), and the first pull-up device (PU-1) share a gate structure extending along a first direction,

wherein a drain of the first pull-down device (PD-1), a drain of the second pull-down device (PD-2), and a drain the first pull-up device (PU-1) are electrically coupled to a first long contact.

10. The SRAM cell of claim 9 , further comprising:

a first landing pad disposed between the second pull-down device (PD-2) and the first pull-up device (PU-1), wherein the first landing pad is electrically coupled to a gate structure of the second pass-gate device (PG-2) by way of a first gate via.

11. The SRAM cell of claim 10 , wherein the first gate via is disposed adjacent to the first long contact.

12. The SRAM cell of claim 9 , wherein a drain of the third pull-down device (PD-3), a drain of the fourth pull-down device (PD-4), and a drain the second pull-up device (PU-2) are electrically coupled to a second long contact.

13. The SRAM cell of claim 12 , further comprising:

a second landing pad disposed between the third pull-down device (PD-3) and the second pull-up device (PU-2), wherein the second landing pad is electrically coupled to a gate structure of the third pass-gate device (PG-3) by way of a second gate via.

14. The SRAM cell of claim 13 , wherein the second gate via is disposed adjacent to the second long contact.

15. A static random access memory (SRAM) cell comprising:

a first pull-down device (PD-1), a second pull-down device (PD-2), a first pass-gate device (PG-1), and a second pass-gate device (PG-2) disposed in a first p-well on a substrate, wherein the first pass-gate device (PG-1) and the first pull-down device (PD-1) share a first active region extending along a first direction, wherein the second pass-gate device (PG-2) and the second pull-down device (PD-2) share a second active region extending along the first direction;

a third pull-down device (PD-3), a fourth pull-down device (PD-4), a third pass-gate device (PG-3), and a fourth pass-gate device (PG-4) disposed in a second p-well on the substrate; and

a first pull-up device (PU-1) and a second pull-up device (PU-2) disposed in an n-well disposed between the first p-well and the second p-well, where a third active region of the first pull-up device (PU-1) extends along the first direction,

wherein the first active region and the second active region are spaced apart by a first spacing,

wherein the second active region and the third active region are spaced apart by a second spacing greater than the first spacing.

16. The SRAM cell of claim 15 , wherein a ratio of the second spacing to the first spacing is between 1.05 and 2.

17. The SRAM cell of claim 15 ,

wherein the first active region comprises two fin structures,

wherein the second active region comprises two fin structures,

wherein the third active region comprises a single fin structure.

18. The SRAM cell of claim 15 , further comprising:

a first landing pad disposed between the second pull-down device (PD-2) and the first pull-up device (PU-1),

wherein the first landing pad is electrically coupled to a gate structure of the second pass-gate device (PG-2) by way of a first gate via,

wherein the first landing pad extends along the first direction.

19. The SRAM cell of claim 18 , further comprising:

a first long contact, wherein a drain of the first pull-down device (PD-1), a drain of the second pull-down device (PD-2), and a drain the first pull-up device (PU-1) are electrically coupled to the first long contact.

20. The SRAM cell of claim 19 ,

wherein the first long contact extends along a second direction perpendicular to the first direction,

wherein the first landing pad spans over the first long contact.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2020
From: LIAW, JHON JHY
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 053244/0790 →
Continuity (2)
Provisional Application 62981317 · Feb 25, 2020
Related Publication 20210265335A1 · Aug 26, 2021