IP Library Granted Patent US 11,450,652
Granted Patent B2
US 11,450,652 · App. 16/882,914 · Granted Sep 20, 2022

Display module manufactured by micro LED transferring method

Inventors: Doyoung Kwag (Suwon-si, KR); Byungchul Kim (Suwon-si, KR); Sangmoo Park (Suwon-si, KR); Minsub Oh (Seoul, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H01L25/167H01L25/0753H01L33/50H01L2933/0041
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Quick Facts
Patent No.
US 11,450,652
App. No.
16/882,914
Granted
Sep 20, 2022
Kind
B2
Abstract

A micro LED transferring method is provided. The transferring method includes selectively applying a color conversion material to a mono-color substrate, the mono-color substrate including first micro LEDs in a first color; obtaining a multi-color substrate based on a result of the applying, the multi-color substrate including the first micro LEDs in the first color and second micro LEDs in a second color different from the first color; and irradiating a laser beam toward the multi-color substrate to transfer the first micro LEDs and the second micro LEDs to a target substrate.

Claims (24)

1. A display module comprising:

a substrate;

a layer including thin film transistor (TFT) layer and provided on the substrate; and

a plurality of pixels arranged at specific pitches on the layer,

wherein each pixel includes first micro light emitting diodes (LEDs) in a first color and second micro LEDs in a second color different from the first color,

wherein the first micro LEDs and the second micro LEDs are transferred from a transfer substrate to the layer,

wherein the transfer substrate is provided as a multi-color substrate in which a plurality of micro LEDs in two or more colors are provided, and

wherein the plurality of micro LEDs have different thicknesses based on an amount of a color conversion material applied to the plurality of micro LEDs.

2. The display module of claim 1 ,

wherein, in each transfer operation, the first micro LEDs and the second micro LEDs are transferred to the TFT layer according to a same transfer pattern.

3. The display module of claim 1 ,

wherein a transfer pattern in transferring at least one of the first micro LEDs and at least one of the second micro LEDs is based on a color pattern of the plurality of micro LEDs in the two or more colors on the multi-color substrate.

4. The display module of claim 3 ,

wherein the transfer pattern comprises at least one of an L-shaped pattern, a triangle-shaped pattern, or a square-shaped pattern.

5. The display module of claim 1 ,

wherein a transfer pattern in transferring at least one of the first micro LEDs and at least one of the second micro LEDs is based on a square-shaped pattern of different colors by the plurality of micro LEDs on the multi-color substrate.

6. The display module of claim 1 ,

wherein a size of each of the first micro LEDs is different from a size of each of the second micro LEDs.

7. The display module of claim 6 ,

wherein each pixel further includes third micro LEDs in a third color different from the first color and the second color, and a size of each of the third micro LEDs is equal to the size of each of the first micro LEDs or the size of each of the second micro LEDs.

8. The display module of claim 1 ,

wherein a micro LED located toward an outer rim portion of the multi-color substrate, among the plurality of micro LEDs, has a greater thickness than a micro LED located at a center portion of the multi-color substrate.

9. The display module of claim 1 ,

wherein a micro LED located toward an outer rim portion of the multi-color substrate, among the plurality of micro LEDs, has a smaller thickness than a micro LED located at a center portion of the multi-color substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2020
From: KWAG, DOYOUNG; KIM, BYUNGCHUL; PARK, SANGMOO; OH, MINSUB
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 052749/0246 →
Priority Claims (1)
KR 10-2019-0069763 · Jun 13, 2019 · national
Continuity (1)
Related Publication 20200395348A1 · Dec 17, 2020