Reconstituted wafer including mold material with recessed conductive feature
A system and method. The system may include an integrated circuit (IC) die having two faces and sides. The system may further include mold material surrounding at least the sides of the IC die. The system may further include a redistribution layer and signal pads. The redistribution layer may be positioned between (a) the signal pads and (b) the mold material and the IC die. The redistribution layer may have conductive paths at least connecting the IC die and at least some of the signal pads. A surface of the mold material may abut the redistribution layer. The surface of the mold material may include at least one recessed area having at least one conductive feature connected to at least one of the conductive paths or the IC die.
1. A system, comprising:
a reconstituted wafer, comprising:
an integrated circuit (IC) die having two faces and sides;
mold material surrounding at least the sides of the IC die;
a redistribution layer; and
signal pads;
wherein the redistribution layer is positioned between (a) the signal pads and (b) the mold material and the IC die, wherein the redistribution layer has conductive paths at least connecting the IC die and at least some of the signal pads;
wherein a surface of the mold material and one of the two faces of the IC die abut the redistribution layer, wherein the surface of the mold material includes at least one recessed area having at least one conductive feature connected to at least one of the conductive paths or the IC die;
wherein the at least one conductive feature of the at least one recessed area includes a ground feature;
wherein the ground feature of the at least one recessed area provides a ground reference, the ground reference being a stripline to provide stripline routing of signals in a layer of the redistribution layer closest to the IC die.
2. The system of claim 1 , wherein the reconstituted wafer further comprises a plurality of IC dies, the mold material, the redistribution layer, and the signal pads, wherein the plurality of IC dies comprises the IC die.
3. The system of claim 2 , wherein the plurality of IC dies further comprises a second IC die, wherein the surface of the mold material and one of two faces of the second IC die abuts the redistribution layer, wherein the IC die and the second IC die are interconnected by at least one of the conductive paths or the at least one conductive feature of the at least one recessed area.
4. The system of claim 2 , wherein the reconstituted wafer has backside mold material.
5. The system of claim 4 , wherein the at least one conductive feature of the at least one recessed area includes a second ground feature, wherein the second ground feature is a ground plane.
6. The system of claim 5 , wherein the IC die is a field-programmable gate array (FPGA) die, a central processing unit (CPU) die, or a graphics processing unit (GPU) die.
7. The system of claim 5 , wherein the IC die is an application specific integrated circuit (ASIC) die.
8. The system of claim 2 , wherein the reconstituted wafer has no backside mold material.
9. The system of claim 1 , wherein the mold material does not surround either of the two faces.
10. The system of claim 1 , wherein the at least one conductive feature of the at least one recessed area includes a conductive path.
11. The system of claim 1 , wherein the at least one conductive feature of the at least one recessed area includes a second ground feature.
12. The system of claim 11 , wherein the second ground feature is a ground plane.
13. The system of claim 1 , wherein the signals are relatively sensitive or relatively high speed signals in the layer of the redistribution layer closest to the IC die, the relatively sensitive or relatively high speed signals being more sensitive or having a higher speed than in a second layer of the redistribution layer, the second layer being farther away from the IC die than the layer.
14. The system of claim 1 , wherein the signal pads are at least two of: at least one signal pin or at least one signal ball.
15. The system of claim 1 , wherein the IC die is mechanically interlocked with the mold material.
16. The system of claim 1 , wherein the IC die is an application specific integrated circuit (ASIC) die.
17. A method, comprising:
creating a reconstituted wafer, the reconstituted wafer comprising an integrated circuit (IC), a mold material, a redistribution layer, and signal pads, wherein the IC die has two faces and sides, wherein the mold material surrounds at least the sides of the IC die, wherein the redistribution layer is positioned between (a) the signal pads and (b) the mold material and the IC die, wherein redistribution layer has conductive paths at least connecting the IC die and at least some of the signal pads, wherein a surface of the mold material and one of the two faces of the IC die abut the redistribution layer, wherein the surface of the mold material includes at least one recessed area having at least one conductive feature connected to at least one of the conductive paths or the IC die;
wherein the at least one conductive feature of the at least one recessed area includes a ground feature;
wherein the ground feature of the at least one recessed area provides a ground reference, the ground reference being a stripline to provide stripline routing of signals in a layer of the redistribution layer closest to the IC die.
18. The system of claim 1 , wherein the IC die is a field-programmable gate array (FPGA) die, a central processing unit (CPU) die, or a graphics processing unit (GPU) die.