IP Library Granted Patent US 11,515,465
Granted Patent B2
US 11,515,465 · App. 16/281,792 · Granted Nov 29, 2022

EMI reduction in piezoelectric micromachined ultrasound transducer array

Inventors: Nikhil Apte (Palo Alto, CA); Chienliu Chang (Los Altos, CA); Shreyas Thakar (San Jose, CA); Mei-Lin Chan (Milpitas, CA)
Assignee: INVENSENSE, INC.
H01L41/0926B06B1/0622B06B1/0688B81B3/0021B81B7/0064G01N29/2437H01L41/047
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Quick Facts
Patent No.
US 11,515,465
App. No.
16/281,792
Granted
Nov 29, 2022
Kind
B2
Abstract

A piezoelectric micromachined ultrasound transducer (PMUT) array may comprise PMUT devices with respective piezoelectric layers and electrode layers. Parasitic capacitance can be reduced when an electrode layer is not shared across PMUT devices but may expose the devices to electromagnetic interference (EMI). A conductive layer located within the structural layer or on a shared plane with the electrode layers may reduce EMI affecting the PMUT array operation.

Claims (32)

1. An array of piezoelectric micromachined ultrasound transducer (PMUT) devices, comprising:

an electrical component layer;

a plurality of PMUT transceivers, wherein each of the plurality of PMUT transceivers comprises:

a piezoelectric layer and a structural layer, wherein the piezoelectric layer is located between the electrical component layer and the structural layer;

a first electrode electrically connected to the electrical component layer and the piezoelectric layer, wherein the first electrode is located between the structural layer and the piezoelectric layer; and

a second electrode electrically connected to the electrical component layer and the piezoelectric layer, wherein the second electrode is located between the electrical component layer and the piezoelectric layer; and

a conductive layer located above the piezoelectric layer and within the structural layer.

2. The array of PMUT devices of claim 1 , wherein the conductive layer at least partially covers the structural layer.

3. The array of PMUT devices of claim 2 , wherein the conductive layer at least partially covers an upper surface of the structural layer.

4. The array of PMUT devices of claim 3 , wherein the conductive layer substantially covers all of the upper surface of the structural layer.

5. The array of PMUT devices of claim 3 , wherein the conductive layer comprises an electromagnetic interference (EMI) layer.

6. The array of PMUT devices of claim 5 , further comprising an oxide layer between the structural layer and the EMI layer.

7. The array of PMUT devices of claim 6 , further comprising a passivation layer covering the EMI layer.

8. The array of PMUT devices of claim 3 , wherein the conductive layer comprises a patterned layer.

9. The array of PMUT devices of claim 8 , wherein the patterned layer comprises a plurality of slots at least partially covering the upper surface of the structural layer.

10. The array of PMUT devices of claim 1 , wherein the conductive layer comprises a ground shield.

11. The array of PMUT devices of claim 1 , wherein the conductive layer comprises a ground mesh.

12. The array of PMUT devices of claim 1 , wherein the conductive layer is located between the piezoelectric layer and the structural layer.

13. The array of PMUT devices of claim 12 , wherein the conductive layer is located in a shared plane with the first electrodes.

14. The array of PMUT devices of claim 12 , wherein the conductive layer comprises a patterned layer.

15. The array of PMUT devices of claim 1 , wherein each of the plurality of PMUT transceivers is configured to operate in either a transmit mode or a receive mode.

16. The array of PMUT devices of claim 1 , wherein the electrical component layer comprises a CMOS layer.

17. An array of piezoelectric micromachined ultrasound transducer (PMUT) devices, comprising:

an electrical component layer;

a plurality of PMUT transceivers, wherein each of the plurality of PMUT transceivers comprises:

a piezoelectric layer and a structural layer, wherein the piezoelectric layer is located between the electrical component layer and the structural layer;

a first electrode electrically connected to the electrical component layer and the piezoelectric layer, wherein the first electrode is located between the structural layer and the piezoelectric layer;

a second electrode electrically connected to the electrical component layer and the piezoelectric layer, wherein the second electrode is located between the electrical component layer and the piezoelectric layer; and

a conductive layer located in a shared plane with the second electrode.

18. The array of PMUT devices of claim 17 , wherein the conductive layer comprises an electromagnetic interference layer.

19. The array of PMUT devices of claim 17 , wherein the conductive layer comprises a patterned layer.

20. The array of PMUT devices of claim 17 , wherein the conductive layer comprises a ground mesh.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2019
From: APTE, NIKHIL; CHANG, CHIENLIU; THAKAR, SHREYAS; CHAN, MEI-LIN
To: INVENSENSE, INC.
Reel/Frame 048563/0770 →
Continuity (2)
Provisional Application 62635486 · Feb 26, 2018
Related Publication 20190267536A1 · Aug 29, 2019