Electronic component, electronic-component mounting board, and electronic-component manufacturing method
An electronic component includes a single-layer glass plate, an outer-surface conductor that is disposed above an outer surface of the single-layer glass plate and that is at least a part of an electrical element, and a terminal electrode that is a terminal of the electrical element. The terminal electrode is disposed above the outer surface of the single-layer glass plate and being electrically connected to the outer-surface conductor.
1. An electronic component comprising:
a single-layer glass plate;
at least one outer-surface conductor that is disposed above an outer surface of the single-layer glass plate and that is at least a part of an electrical element;
at least one terminal electrode that is a terminal of the electrical element, the terminal electrode being disposed above the outer surface of the single-layer glass plate and being electrically connected to the outer-surface conductor; and
an underlying insulation layer that is disposed on the outer surface of the single-layer glass plate, wherein
the terminal electrode is disposed on the underlying insulation layer.
2. The electronic component according to claim 1 , wherein
the outer surface includes a bottom surface that is one principal surface of the single-layer glass plate,
the at least one terminal electrode includes a first terminal electrode and a second terminal electrode, which are input/output terminals of the electrical element, and
the first terminal electrode and the second terminal electrode each have a shape including a principal surface above the bottom surface, the principal surface being parallel to the bottom surface.
3. The electronic component according to claim 1 , further comprising:
a through wiring that is at least a part of the electrical element, the through wiring extending through a through hole formed in the single-layer glass plate and being electrically connected to the outer-surface conductor.
4. The electronic component according to claim 3 , wherein
the outer surface includes a bottom surface that is one principal surface of the single-layer glass plate and a top surface that is positioned on a back side of the bottom surface,
the at least one terminal electrode includes a first terminal electrode and a second terminal electrode, which are input/output terminals of the electrical element,
the first terminal electrode and the second terminal electrode each have a shape including a principal surface above the bottom surface, the principal surface being parallel to the bottom surface,
the at least one outer-surface conductor includes a bottom-surface conductor and a top-surface conductor that are disposed above the bottom surface and above the top surface, respectively, and that are electrically connected to each other by the through wiring, and
a circularly extending wiring that is formed from the bottom-surface conductor, the top-surface conductor, and the through wiring circularly extends around a winding axis that is parallel to the bottom surface.
5. The electronic component according to claim 4 , wherein
the single-layer glass plate includes a cavity or a crystallization portion at a location including the winding axis.
6. The electronic component according to claim 4 , wherein
the circularly extending wiring circularly extends at least two times around the wiring axis, and
the single-layer glass plate includes a cavity or a crystallization portion between adjacent portions of the circularly extending wiring.
7. The electronic component according to claim 1 , wherein
the single-layer glass plate includes a cavity or a crystallization portion in a vicinity of the terminal electrode.
8. The electronic component according to claim 1 , wherein
the outer surface includes a bottom surface that is one principal surface of the single-layer glass plate and a top surface that is positioned on a back side of the bottom surface,
the outer-surface conductor includes a substantially planar bottom-surface flat-plate electrode that is disposed above the bottom surface and a substantially planar top-surface flat-plate electrode that is disposed above the top surface, and
the single-layer glass plate includes a cavity or a crystallization portion at a location interposed between the bottom-surface flat-plate electrode and the top-surface flat-plate electrode.
9. The electronic component according to claim 8 , wherein
the single-layer glass plate includes the cavity at the location interposed between the bottom-surface flat-plate electrode and the top-surface flat-plate electrode, and
the electronic component further includes a highly dielectric portion that has a dielectric constant higher than a dielectric constant of the single-layer glass plate and that is disposed in the cavity.
10. An electronic-component manufacturing method that is a method of manufacturing the electronic component according to claim 1 , the method comprising:
forming the outer-surface conductor on an outer surface of a mother single-layer glass plate; and
cutting the mother single-layer glass plate, on which the outer-surface conductor has been formed, by a photolithography method to form the single-layer glass plate.
11. An electronic-component mounting board comprising:
the electronic component of claim 1 ; and
a glass board at which the electronic component is mounted.
12. The electronic component according to claim 1 , further comprising
an anchor section that protrudes into the single-layer glass plate from the terminal electrode.
13. The electronic component according to claim 1 , wherein
the underlying insulation layer is disposed on the outer-surface conductor.
14. The electronic component according to claim 1 , wherein
the single-layer glass plate includes a principal surface that is the outer surface where the outer-surface conductor is disposed, a side surface that is orthogonal to the principal surface, and a cavity that opens in the side surface.
15. An electronic component comprising:
a single-layer glass plate;
at least one outer-surface conductor that is disposed above an outer surface of the single-layer glass plate and that is at least a part of an electrical element; and
at least one terminal electrode that is a terminal of the electrical element, the terminal electrode being disposed above the outer surface of the single-layer glass plate and being electrically connected to the outer-surface conductor,
wherein
the single-layer glass plate includes a low transmittance portion that has a light transmittance lower than a light transmittance of a vicinity thereof.
16. The electronic component according to claim 15 , wherein
the low transmittance portion is positioned on an outer peripheral edge of a principal surface of the single-layer glass plate.
17. The electronic component according to claim 15 , wherein
the low transmittance portion has a cross-shape at a principal surface of the single-layer glass plate.
18. An electronic component comprising:
a single-layer glass plate;
at least one outer-surface conductor that is disposed above an outer surface of the single-layer glass plate and that is at least a part of an electrical element;
at least one terminal electrode that is a terminal of the electrical element, the terminal electrode being disposed above the outer surface of the single-layer glass plate and being electrically connected to the outer-surface conductor; and
a second single-layer glass plate that differs from the single-layer glass plate, wherein
the outer surface of the single-layer glass plate includes a grooved portion that is recessed with respect to a vicinity thereof,
the outer-surface conductor includes a grooved-portion conductor that is disposed in the grooved portion, and
the second single-layer glass plate is disposed above the grooved-portion conductor.
19. The electronic component according to claim 13 , wherein
a thickness of the grooved-portion conductor is less than a depth of the grooved portion.
20. The electronic component according to claim 13 , wherein
a thickness of the grooved-portion conductor is greater than a depth of the grooved portion.
21. The electronic component according to claim 18 , wherein
the grooved-portion conductor includes a substantially planar grooved-portion flat-plate electrode,
the outer-surface conductor includes a substantially planar facing flat-plate electrode facing the grooved-portion flat-plate electrode with the single-layer glass plate or the second single-layer glass plate interposed therebetween, and
the grooved-portion flat-plate electrode or the facing flat-plate electrode is the terminal electrode.
22. An electronic component comprising:
a single-layer glass plate;
at least one outer-surface conductor that is disposed above an outer surface of the single-layer glass plate and that is at least a part of an electrical element; and
at least one terminal electrode that is a terminal of the electrical element, the terminal electrode being disposed above the outer surface of the single-layer glass plate and being electrically connected to the outer-surface conductor,
wherein
the single-layer glass plate includes a reinforcing portion that is harder than a vicinity thereof.
23. The electronic component according to claim 22 , wherein
the reinforcing portion is positioned below the outer-surface conductor or below the terminal electrode.