A semiconductor device includes a substrate, an epitaxial stack disposed on the substrate, a first connection layer between the epitaxial stack and the substrate and a first electrode disposed on the first connection layer. The substrate has a first side surface and a second side surface. The epitaxial stack has a semiconductor structure with a first lateral surface adjacent to the first side surface and a second lateral surface opposing the first lateral surface and adjacent to the second side surface. The first connection layer has a first protruding portion extending beyond the first lateral surface and a second protruding portion extending beyond the second lateral surface. The first electrode is in contact with the first protruding portion and the second protruding portion.
1. A semiconductor device, comprising:
a substrate having a first side surface and a second side surface;
an epitaxial stack disposed on the substrate and having a semiconductor structure with a first lateral surface adjacent to the first side surface and a second lateral surface opposing the first lateral surface and adjacent to the second side surface;
a first connection layer between the epitaxial stack and the substrate, and having a first protruding portion extending beyond the first lateral surface and a second protruding portion extending beyond the second lateral surface; and
a first electrode disposed on the first connection layer and being in contact with the first protruding portion and the second protruding portion.
2. The semiconductor device of claim 1 , wherein the first electrode comprises
a body portion; and
a surrounding portion connected to the body portion and covering the first lateral surface and the second lateral surface.
3. The semiconductor device of claim 2 , further comprising a second electrode disposed on the epitaxial stack, wherein the first electrode and the second electrode are disposed on the same side of the substrate.
4. The semiconductor device of claim 3 , wherein the first electrode surrounds the second electrode.
5. The semiconductor device of claim 3 , further comprising a second connection layer on the epitaxial stack and having a first width, wherein the semiconductor structure has a second width less than the first width.
6. The semiconductor device of claim 3 , further comprising a first gap between the body portion and the second electrode, and a second gap between the surrounding portion and the second electrode, wherein the second gap is narrower than the first gap.
7. The semiconductor device of claim 1 , further comprising an insulating layer covering the first connection layer and having a first opening portion on the first protruding portion and a second opening portion on the second protruding portion.
8. The semiconductor device of claim 1 , further comprising an insulating layer having a first opening portion shaped as a ring.
9. The semiconductor device of claim 8 , wherein the first electrode comprises
a body portion; and
a surrounding portion connected to the body portion and having the same shape as the first opening portion.
10. The semiconductor device of claim 9 , wherein the surrounding portion has a larger area than the first opening portion in a plan view.
11. The semiconductor device of claim 1 , in a cross-sectional view, further comprising a first distance between the first lateral surface and the first side surface and a second distance between the second lateral surface and the second side surface, wherein a difference between the first distance and the second distance is less than 30% of the first distance.
12. The semiconductor device of claim 1 , in a cross-sectional view, further comprising a first distance between the first lateral surface and the first side surface and a second distance between the second lateral surface and the second side surface, wherein the first distance is equal to the second distance.
13. The semiconductor device of claim 1 , wherein the epitaxial stack comprises a plurality of columnar bodies.
14. The semiconductor device of claim 13 , wherein the plurality of columnar bodies has a first edge near the first side surface, and the first lateral surface is closer to the first side surface than the first edge.
15. The semiconductor device of claim 1 , wherein the first electrode has a height less than 8.5 μm.
16. The semiconductor device of claim 1 , further comprising an adhesive layer between the substrate and the epitaxial stack.
17. The semiconductor device of claim 1 , further comprising a first pad structure covering the first electrode and having a material different from that of the first electrode.
18. The semiconductor device of claim 1 , wherein the semiconductor device emits a coherent light.
19. The semiconductor device of claim 1 , further comprising an anti-reflection layer covering the substrate.
20. A semiconductor apparatus comprising:
a circuit board;
a semiconductor device of claim 1 on the circuit board; and
an optical array on the semiconductor device.