IP Library › Granted Patent US 11,534,870
Granted Patent B2
US 11,534,870 · App. 17/145,838 · Granted Dec 27, 2022

Metal particle

Inventor: Shigenobu Sekine (Tokyo, JP)
Assignee: Napra Co., Ltd.
B23K35/0244B23K35/262B23K2103/08
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Quick Facts
Patent No.
US 11,534,870
App. No.
17/145,838
Granted
Dec 27, 2022
Kind
B2
Abstract

According to this invention, provided is a metal particle that includes an intermetallic compound composed of Sn, Cu and Ni, in a basal phase that contains Sn and an Sn—Cu alloy, and at least parts of the Sn—Cu alloy and the intermetallic compound in the basal phase form an endotaxial joint.

Claims (4)

1. A metal particle comprising an intermetallic compound composed of Sn, Cu and Ni, in a basal phase that contains Sn and an Sn—Cu alloy, at least parts of the Sn—Cu alloy and the intermetallic compound in the basal phase forming an endotaxial joint.

2. The metal particle according to claim 1 , having a particle size of 1 μm to 50 μm.

3. The metal particle according to claim 1 , comprising 0.7 to 40% by mass of Cu, 0.1 to 5% by mass of Ni, and the balance of Sn.

4. The metal particle according to claim 3 , having a particle size of 1 μm to 50 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2021
From: SEKINE, SHIGENOBU
To: NAPRA CO., LTD.
Reel/Frame 054878/0006 →
Continuity (1)
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