Switchable objects and methods of manufacture
A simplified switchable object and methods of making same are provided. The methods may include steps of applying a switchable material on a first surface of a first substrate, the switchable material having a thickness and a shape; applying a barrier material on the first substrate, circumferential to the switchable material; and applying a second substrate over top of, and in contact with, the switchable material and the barrier material, the first substrate, second substrate and barrier material defining a closed chamber encapsulating the switchable material. The methods may further include a step of applying a seal material.
1. A method of making a switchable object, comprising:
applying switchable material on a first substrate;
applying a second substrate over a top of, and in contact with, the switchable material;
cutting a first bus-bar platform by performing a first kiss cut on the first substrate, thereby removing a portion of the first substrate to provide the first busbar platform, wherein the first kiss cut is performed by a laser; and
applying a barrier material on the first substrate,
wherein the barrier material is applied before applying the switchable material, and
wherein the method further comprises removing a portion of the barrier material by performing a third kiss cut.
2. The method of claim 1 , wherein the laser is a pulsed beam.
3. The method of claim 1 , wherein the laser is from about 0.1 to about 5 W.
4. The method of claim 1 , wherein the laser is a CO2 laser.
5. The method of claim 1 , wherein the laser has a wavelength of from about 9 to about 11 microns.
6. The method of claim 1 , wherein the first kiss cut is performed under an inert gas blanket.
7. The method of claim 1 , further comprising:
cutting a second bus-bar platform by performing a second kiss cut on the second substrate, thereby removing a portion of the second substrate to provide the second busbar platform.
8. The method of claim 7 , wherein the second kiss cut is performed by a laser.
9. The method of claim 7 , further comprising, after performing the first kiss cut and before performing the second kiss cut, inverting the switchable object.
10. The method of claim 7 , wherein the second kiss cut cuts through the second substrate and a portion of the switchable material, and does not contact the first substrate.
11. The method of claim 1 , wherein the first kiss cut cuts through the first substrate and a portion of the switchable material, and does not contact the second substrate.
12. The method of claim 1 , wherein the third kiss cut is performed by a laser.
13. The method of claim 1 , wherein the barrier material is applied after applying the switchable material, and wherein the barrier material, the first substrate, and the second substrate encapsulate the switchable material.
14. The method of claim 1 , wherein the first substrate, the second substrate, or the first and the second substrates, comprise a transparent conductive layer.
15. The method of claim 1 , wherein the first substrate, the second substrate, or the first and the second substrates, comprise a patterned transparent conductive layer, the patterned transparent conductive layer comprising at least two electrodes, and wherein the transparent conductive layer is selected from the group consisting of: gold, indium tin oxide, metal oxide, fluorine tin oxide, silver, carbon, graphene, carbon nanotubes, silver wire, and a combination thereof.
16. The method of claim 1 , wherein the laser is from about 0.5 to about 2 W.
17. A method of making a switchable object, comprising:
applying switchable material on a first substrate;
applying a second substrate over a top of, and in contact with, the switchable material;
cutting a first bus-bar platform by performing a first kiss cut on the first substrate, thereby removing a portion of the first substrate to provide the first busbar platform, wherein the first kiss cut is performed by a laser; and
applying a seal material.
18. A method of making a switchable object, comprising:
applying switchable material on a first substrate;
applying a second substrate over a top of, and in contact with, the switchable material;
cutting a first bus-bar platform by performing a first kiss cut on the first substrate, thereby removing a portion of the first substrate to provide the first busbar platform, wherein the first kiss cut is performed by a laser; and
applying a barrier material on the first substrate, wherein the switchable material is photochromic and electrochromic.