IP Library Granted Patent US 11,541,504
Granted Patent B2
US 11,541,504 · App. 16/456,904 · Granted Jan 3, 2023

Recycled polishing pad

Inventors: Bong Su Ahn (Hwaseong-si, KR); Pal Kon Kim (Cheonan-si, KR); Young Jun Yoo (Cheonan-si, KR); Si Hyeong Kim (Hwaseong-si, KR); Yoon Ho Kim (Hwaseong-si, KR); Jin Ok Moon (Hwaseong-si, KR); Seung Taek Oh (Cheonan-si, KR)
B24B37/205
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,541,504
App. No.
16/456,904
Granted
Jan 3, 2023
Kind
B2
Abstract

A recycled polishing pad includes an upper layer pad and a supplementary pad. The upper layer pad includes a first surface and a second surface opposite to the first surface. The first surface has a plurality of first grooves and the second surface has a plurality of second grooves. The upper layer pad further includes a connecting body connecting the first grooves and the second grooves. The supplementary pad is in contact with the second surface of the upper layer pad. A depth of each of the first grooves is less than a depth of each of the second grooves.

Claims (34)

1. A recycled polishing pad comprising:

an upper layer pad from a worn polishing pad, the upper layer pad comprising a first surface having a plurality of first grooves, a second surface having a plurality of second grooves and being opposite to the first surface, and a connecting body connecting the plurality of first grooves and the plurality of second grooves; and

a supplementary pad bonded to the first surface of the upper layer pad,

wherein a depth of each of the plurality of first grooves has been reduced from a previous polishing process and is less than a depth of each of the plurality of second grooves.

2. The recycled polishing pad of claim 1 , wherein a thickness ratio of the upper layer pad to the supplementary pad ranges from about 4:4 to 7:1.

3. The recycled polishing pad of claim 1 , further comprising a window in the upper layer pad.

4. The recycled polishing pad of claim 3 , wherein the supplementary pad is in direct contact with at least one surface of the window and the window and the first surface of the upper layer pad define a substantially continuous surface.

5. The recycled polishing pad of claim 3 , wherein the supplementary pad has an opening in communication with the window.

6. The recycled polishing pad of claim 3 , wherein:

the window extends through the upper layer pad and the supplementary pad; and

a surface of the window and an at least partially exposed surface of the supplementary pad, which is opposite the first surface, define a substantially continuous surface.

7. The recycled polishing pad of claim 1 , wherein the supplementary pad extends through the upper layer pad.

8. The recycled polishing pad of claim 1 , wherein the plurality of first grooves and the plurality of second grooves are rectangular.

9. The recycled polishing pad of claim 1 , wherein the plurality of first grooves and the plurality of second grooves are misaligned with each other.

10. The recycled polishing pad of claim 1 , wherein a horizontal width of each of the plurality of first grooves is different from a horizontal width of each of the plurality of second grooves.

11. The recycled polishing pad of claim 1 , wherein an interval between adjacent ones of the plurality of first grooves is different from an interval between adjacent ones of the plurality of second grooves.

12. The recycled polishing pad of claim 1 , wherein a depth of each of the first grooves at an intermediate portion of the upper layer pad is less than a depth of each of the first grooves at a central portion and a perimeter portion of the upper layer pad, and wherein the intermediate portion of the upper layer pad is between the central portion and the perimeter portion of the upper layer pad.

13. The recycled polishing pad of claim 1 , wherein portions of the supplementary pad fill inner volumes of the plurality of first grooves.

14. A recycled polishing pad comprising:

an upper layer pad from a worn polishing pad, the upper layer pad comprising a first surface having a plurality of first grooves, a second surface having a plurality of second grooves and being opposite to the first surface, and a connecting body connecting the first surface and the second surface; and

a supplementary pad bonded to the first surface of the upper layer pad,

wherein a depth of each of the plurality of first grooves has been reduced from a previous polishing process and is less than a depth of each of the plurality of second grooves, the plurality of first grooves and the plurality of second grooves have a round shape.

15. The recycled polishing pad of claim 14 , wherein:

a width of each of the plurality of first grooves decreases from the first surface toward the connecting body; and

a width of each of the plurality of second grooves decreases from the second surface toward the connecting body.

16. The recycled polishing pad of claim 14 , wherein a width of each of the plurality of first grooves is less than a width of each of the plurality of second grooves.

17. The recycled polishing pad of claim 14 , wherein the plurality of first grooves and the plurality of second grooves are misaligned with each other.

18. A recycled polishing pad comprising:

an upper layer pad from a worn polishing pad, the upper layer pad comprising a first surface having a plurality of first grooves, a second surface having a plurality of second grooves and being opposite to the first surface, and a connecting body connecting the plurality of first grooves and the plurality of second grooves;

a supplementary pad below the upper layer pad and in contact with the first surface; and

a lower layer pad below the supplementary pad,

wherein a depth of each of the first grooves has been reduced from a previous polishing process and is less than a depth of each of the second grooves.

19. The recycled polishing pad of claim 18 , further comprising a first adhesive layer between the supplementary pad and the lower layer pad.

20. The recycled polishing pad of claim 18 , further comprising a second adhesive layer below the lower layer pad.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2019
From: AHN, BONG SU; KIM, SI HYEONG; KIM, YOON HO; MOON, JIN OK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049625/0433 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2019
From: KIM, PAL KON; YOO, YOUNG JUN; OH, SEUNG TAEK
To: FNS TECH CO., LTD.
Reel/Frame 049625/0540 →
Priority Claims (1)
KR 10-2019-0011257 · Jan 29, 2019 · national
Continuity (1)
Related Publication 20200238472A1 · Jul 30, 2020